ChipMOS Technologies Inc. (CPIA)
XSTU 
Summary
CPIA Chart
ChipMOS Technologies: Could Soon Show The Path Ahead
ChipMOS TECHNOLOGIES has been looking for directions lately, but a catalyst may not be so far away, which could send it lower or, alternatively, higher. The charts suggest the stock has been retracing prior moves, but it likely needs a catalyst to get past what is likely to be resistance. Long IMOS has arguments in its favor, which include dividend payouts and valuations that are on the low side, if not undervalued.
ChipMOS TECHNOLOGIES INC. (IMOS) Q1 2025 Earnings Call Transcript
ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS ) Q1 2025 Earnings Conference Call May 13, 2025 3:00 AM ET Company Participants GS Shen – Strategy and Investor Relations S.J.
What To Do After ChipMOS Stock Slid Below $20 (Rating Downgrade)
ChipMOS reported a 5.7% Y/Y revenue decline in Q4 2025, causing investor concerns and a subsequent stock drop to $18.50. IMOS stock fell below $20 after facing near-term headwinds with inventory adjustments and declining utilization rates, but long-term growth potential remains. Related companies like Aehr Test Systems and Ultra Clean also face challenges, with UCTT rated as a strong sell by Seeking Alpha's Quant Score system.
ChipMOS Technologies Inc. Dividends
| IMOS In 10 months Estimated | Annual | $0.82 Per Share |
| IMOS 1 month ago Paid | Annual | $0.82 Per Share |
| IMOS 27 Jun 2024 Paid | Annual | $1.11 Per Share |
| IMOS 29 Jun 2023 Paid | Annual | $1.5 Per Share |
| IMOS 29 Jun 2022 Paid | Annual | $2.92 Per Share |
| IMOS 6 Aug 2021 Paid | Annual | $1.57 Per Share |
ChipMOS Technologies Inc. Earnings
| 11 Nov 2025 (In 3 months) Date | | 0.35 Cons. EPS | - EPS |
| 3 Nov 2025 (In 2 months) Date | | - Cons. EPS | - EPS |
| 19 Aug 2025 (In 1 week) Date | | 0.29 Cons. EPS | - EPS |
| 12 Aug 2025 12 Aug 2025 Date | | - Cons. EPS | - EPS |
| 9 May 2025 Date | | - Cons. EPS | 0.15 EPS |
| IMOS In 10 months Estimated | Annual | $0.82 Per Share |
| IMOS 1 month ago Paid | Annual | $0.82 Per Share |
| IMOS 27 Jun 2024 Paid | Annual | $1.11 Per Share |
| IMOS 29 Jun 2023 Paid | Annual | $1.5 Per Share |
| IMOS 29 Jun 2022 Paid | Annual | $2.92 Per Share |
| IMOS 6 Aug 2021 Paid | Annual | $1.57 Per Share |
| 11 Nov 2025 (In 3 months) Date | | 0.35 Cons. EPS | - EPS |
| 3 Nov 2025 (In 2 months) Date | | - Cons. EPS | - EPS |
| 19 Aug 2025 (In 1 week) Date | | 0.29 Cons. EPS | - EPS |
| 12 Aug 2025 12 Aug 2025 Date | | - Cons. EPS | - EPS |
| 9 May 2025 Date | | - Cons. EPS | 0.15 EPS |
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ChipMOS Technologies Inc. Profile
| Semiconductors Industry | Technology Sector | Shih-Jye Cheng CEO | XSTU Exchange | US16965P2020 ISIN |
| TW Country | 5,688 Employees | 27 Jun 2025 Last Dividend | 31 Oct 2016 Last Split | - IPO Date |
Overview
ChipMOS TECHNOLOGIES INC. is a leading provider in the semiconductor industry, dedicated to the research, development, manufacturing, and sales of high-integration and high-precision integrated circuits, along with related assembly and testing services. With operations spanning the People's Republic of China, Japan, Singapore, and other global markets, the company delivers comprehensive solutions through its diverse service segments including Testing, Assembly, Testing and Assembly for LCD, OLED, and Other Display Panel Driver Semiconductors, Bumping, and Others. Founded in 1997 and headquartered in Hsinchu, Taiwan, ChipMOS has solidified its presence in the semiconductor sector by catering to a wide array of applications from personal computing and graphics to communications, mobile products, and automotive/industrial display panels.
Products and Services
ChipMOS TECHNOLOGIES INC. offers a wide range of back-end assembly and testing services vital to the semiconductor industry:
- Engineering Test, Wafer Probing, and Final Test: Specialized services for both memory and logic/mixed-signal semiconductors, focusing on ensuring the performance and reliability of the chips before they go to market.
- Leadframe-based and Organic Substrate-based Package Assembly: Provides essential assembly services for memory and logic/mixed-signal semiconductors, utilizing both leadframe and organic substrate technologies to meet different requirement and application needs.
- Gold Bumping: Offers gold bumping services, a critical process for creating connections on chips before they are packaged, which is essential for LCD, OLED, and other display drivers.
- Reel to Reel Assembly and Test Services: Tailored for LCD, OLED, and other panel display driver semiconductors, these services ensure that display technologies meet the stringent quality requirements before integration into consumer products.
The range of services offered by ChipMOS caters to a broad scope of applications, including but not limited to personal computers, gaming consoles, communications equipment, mobile devices like cellular handsets and tablets, consumer electronics, as well as automotive and industrial display applications. This extensive portfolio highlights ChipMOS’s commitment to supporting the evolving needs of the semiconductor industry with high-quality, precision-driven solutions.
Contact Information
