0021

Tianshui Huatian Technology Co., Ltd. (002185)

Market Closed
9 Jul, 01:31
XSHE XSHE
¥
9. 76
-0.16
-1.61%
¥
31.53B Market Cap
- P/E Ratio
0.09% Div Yield
74,467,698 Volume
- Eps
¥ 9.92
Previous Close
Day Range
9.71 10.04
Year Range
7.19 14.52
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Summary

002185 closed today lower at ¥9.76, a decrease of 1.61% from yesterday's close, completing a monthly decrease of -2.89% or ¥0.29. Over the past 12 months, 002185 stock lost -15.13%.
002185 is not paying dividends to its shareholders.
The last earnings report, released on Apr 25, 2025, exceeded the consensus estimates by 0.08%. On average, the company has surpassed earnings expectations by 0.04%, based on the last three reports.
The stock of the company had never split.
The company's stock is traded on 1 different exchanges and in various currencies, with the primary listing on XSHE (CNY).

002185 Chart

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Chart with 60 data points.
The chart has 1 X axis displaying categories.
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Tianshui Huatian Technology Co., Ltd. Dividends

0021
002185 2 months ago
Other
¥0.06 Per Share
0021
002185 20 Jun 2024
Other
¥0.02 Per Share
0021
002185 21 Jun 2023
Other
¥0.03 Per Share
0021
002185 29 Jun 2022
Other
¥0.04 Per Share
0021
002185 18 Jun 2021
Other
¥0.02 Per Share

Tianshui Huatian Technology Co., Ltd. Earnings

25 Apr 2025 Date
-
Cons. EPS
0.08
EPS
29 Oct 2024 Date
0.05
Cons. EPS
0.04
EPS
28 Aug 2024 Date
-
Cons. EPS
0.05
EPS
28 Apr 2024 Date
-
Cons. EPS
0.02
EPS
26 Apr 2024 Date
-
Cons. EPS
0.05
EPS
0021
002185 2 months ago
Other
¥0.06 Per Share
0021
002185 20 Jun 2024
Other
¥0.02 Per Share
0021
002185 21 Jun 2023
Other
¥0.03 Per Share
0021
002185 29 Jun 2022
Other
¥0.04 Per Share
0021
002185 18 Jun 2021
Other
¥0.02 Per Share
25 Apr 2025 Date
-
Cons. EPS
0.08
EPS
29 Oct 2024 Date
0.05
Cons. EPS
0.04
EPS
28 Aug 2024 Date
-
Cons. EPS
0.05
EPS
28 Apr 2024 Date
-
Cons. EPS
0.02
EPS
26 Apr 2024 Date
-
Cons. EPS
0.05
EPS

Tianshui Huatian Technology Co., Ltd. (002185) FAQ

What is the stock price today?

The current price is ¥9.76.

On which exchange is it traded?

Tianshui Huatian Technology Co., Ltd. is listed on XSHE.

What is its stock symbol?

The ticker symbol is 002185.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.09%.

What is its market cap?

As of today, the market cap is 31.53B.

Has Tianshui Huatian Technology Co., Ltd. ever had a stock split?

No, there has never been a stock split.

Tianshui Huatian Technology Co., Ltd. Profile

Semiconductor Equipment & Materials Industry
Technology Sector
Mr. Wei Bing Cui CEO
XSHE Exchange
CNE100000825 ISIN
CN Country
29,207 Employees
- Last Dividend
20 Jun 2017 Last Split
20 Nov 2007 IPO Date

Overview

Tianshui Huatian Technology Co., Ltd., established in 2003, is a leading provider of integrated circuit packaging and testing services, operating both domestically within India and on an international scale. Headquartered in Tianshui, China, the company has made significant strides in the semiconductor industry, offering a wide range of high-quality services tailored to meet the evolving needs of its clients in the electronics sector.

Products and Services

  • Lead Frame Packaging Products

    These involve the encapsulation of semiconductor devices with a metal frame that serves both as a mechanical support and a means of electrical connection to the printed circuit board. This technology is widely used for its reliability and cost-effectiveness.

  • Substrate Packaging Products

    Substrate packaging offers a platform for integrating multiple semiconductor devices, providing mechanical support and routing electrical connections. This approach is essential for complex circuits and is pivotal in advancing miniaturization and performance enhancements in electronics.

  • Flip Chip Packaging Products

    By connecting semiconductor devices directly to the substrate or circuit board, flip chip technology significantly reduces package size and improves performance. This method is crucial for modern, high-density electronic devices.

  • System-in-Package (SiP)

    Combining multiple integrated circuits into a single package, SiP technology enables the delivery of complete system functionality in a compact form. This integration reduces the footprint of electronic components, facilitating the development of smaller, more powerful devices.

  • Bumping and Wafer Level Products

    Focused on the creation of solder bumps on the wafer surface, this technology is fundamental for flip chip attachments. It plays a critical role in the assembly process of semiconductor devices, offering precision and scalability.

  • MEMS and Sensors

    Offering packaging solutions for Micro-Electro-Mechanical Systems (MEMS) and sensors, Tianshui Huatian Technology Co., Ltd. caters to a wide array of industries, including automotive, consumer electronics, and healthcare, providing tailored encapsulation that meets the unique demands of these delicate systems.

  • Testing Services

    The company provides comprehensive testing services to ensure the functionality, reliability, and performance of integrated circuits and electronic components, adhering to the highest industry standards.

  • Co-Design Simulation Services

    These services involve close collaboration with clients to simulate and optimize the packaging and integration of semiconductor devices, ensuring the best possible performance and compatibility with existing systems.

Contact Information

Address: No. 14, Shuangqiao Road, Tianshui, China, 741001
Phone: 86 93 8863 1000