Shinko Electric Industries Co., Ltd. (SHEGF)

Overview

Shinko Electric Industries Co., Ltd., a profound entity in the semiconductor industry, has established its repute through the development, production, and sale of a wide array of semiconductor packages primarily within Japan. Since its inception in 1946, the company has expanded its technological horizons to cater to a varied range of industries including computer and networking, mobile communication, industrial sectors as well as the Internet of Things (IoT), and automotive sectors. Operating under the aegis of Fujitsu Limited, Shinko Electric Industries has fortified its presence in Nagano, Japan, where its headquarters are located. Through its dedication to innovation and quality, Shinko Electric Industries has become an indispensable part of the semiconductor ecosystem, providing advanced packaging solutions and contributing significantly to the technological advancements in various fields.

Products and Services

• Plastic Laminated Packages and Leadframes:

  These are foundational components for integrated circuits, providing essential mechanical support and electrical connectivity. Shinko Electric Industries specializes in manufacturing high-quality, reliable plastic laminated packages and leadframes tailored for diverse applications.

• Glass-to-Metal Seals and Heat Spreaders:

  Glass-to-metal seals offer hermetic sealing for sensitive electronic components, while heat spreaders assist in managing thermal performance of devices. Both products are critical for ensuring the reliability and longevity of semiconductor devices.

• Arresters and Ceramic Electrostatic Chuck Products:

  These products play crucial roles in protecting electronic circuits from sudden surges (arresters) and in handling wafer processing through electrostatic forces (ceramic electrostatic chuck products), thereby facilitating smooth and efficient semiconductor manufacturing processes.

• IC Packages and System Module Assemblies:

  Shinko Electric provides comprehensive integrated circuit packaging solutions and services for system module assembly, enabling the miniaturization and integration of complex systems for enhanced performance and functionality.

• Various Substrates:

  Includes a broad spectrum of substrates such as flip-chip package, plastic-BGA, coreless, and 2.3D package, which are essential for modern semiconductor devices, offering improved electrical performance and reduced form factors.

• Metal Products:

  The company also supplies a variety of metal products that find extensive applications in semiconductor packaging and assembly, underscoring its capability to cater to diverse manufacturing needs.

• Molded Core Embedded Package:

  This is a compact and thin packaging solution which integrates IC chips with active/passive components, suitable for small-sized electronic devices and various modules, aiming at space efficiency and enhanced performance.

• Bare Die and Molded Underfill Flip-Chip Packages:

  These advanced packaging techniques offer superior electrical performance, reduced package size, and enhanced thermal management, supporting the development of high-performance electronic systems.

• High-Heat-Dissipation Flip-Chip Packages:

  Designed for applications requiring efficient thermal management, these packages ensure reliable performance under high thermal loads, vital for high-speed and high-power semiconductor devices.

• Copper Pillars:

  Copper pillar bumping is a key technology for flip-chip interconnects, providing improved performance over traditional solder bumps. Shinko Electric Industries manufactures copper pillars that support the trend towards finer pitch interconnects in semiconductor packages.

• CAN Packages for High-Speed Optical Communication:

  These packages are designed to meet the stringent requirements of high-speed optical communication applications, offering robust packaging solutions that ensure signal integrity and reliability in high-speed data transmission.