Han's Laser Technology Industry Group Co., Ltd. logo

Han's Laser Technology Industry Group Co., Ltd. (002008)

Market Closed
6 Jun, 06:57
XSHE XSHE
¥
23. 36
-0.13
-0.55%
¥
24.52B Market Cap
- P/E Ratio
0.8% Div Yield
9,254,939 Volume
- Eps
¥ 23.49
Previous Close
Day Range
23.27 23.51
Year Range
18.02 30.65

Summary

002008 closed Friday lower at ¥23.36, a decrease of 0.55% from Thursday's close, completing a monthly increase of 0.04% or ¥0.01. Over the past 12 months, 002008 stock lost -6.56%.
002008 is not paying dividends to its shareholders.
The last earnings report, released on Oct 24, 2024, exceeded the consensus estimates by 0.19%. On average, the company has surpassed earnings expectations by 0.32%, based on the last three reports.
The stock of the company had never split.
The company's stock is traded on 1 different exchanges and in various currencies, with the primary listing on XSHE (CNY).
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002008 Chart

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Han's Laser Technology Industry Group Co., Ltd. Dividends

Han's Laser Technology Industry Group Co., Ltd. logo
002008 2 weeks ago
Other
¥0.35 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 17 May 2024
Other
¥0.2 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 18 May 2023
Other
¥0.2 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 29 Apr 2022
Other
¥0.4 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 13 May 2021
Other
¥0.2 Per Share

Han's Laser Technology Industry Group Co., Ltd. Earnings

24 Oct 2024 Date
-
Cons. EPS
0.19
EPS
20 Aug 2024 Date
-
Cons. EPS
0.23
EPS
8 May 2024 Date
0.41
Cons. EPS
0.94
EPS
17 Apr 2024 Date
0.25
Cons. EPS
0.18
EPS
23 Oct 2023 Date
0.3
Cons. EPS
0.2
EPS
Han's Laser Technology Industry Group Co., Ltd. logo
002008 2 weeks ago
Other
¥0.35 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 17 May 2024
Other
¥0.2 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 18 May 2023
Other
¥0.2 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 29 Apr 2022
Other
¥0.4 Per Share
Han's Laser Technology Industry Group Co., Ltd. logo
002008 13 May 2021
Other
¥0.2 Per Share
24 Oct 2024 Date
-
Cons. EPS
0.19
EPS
20 Aug 2024 Date
-
Cons. EPS
0.23
EPS
8 May 2024 Date
0.41
Cons. EPS
0.94
EPS
17 Apr 2024 Date
0.25
Cons. EPS
0.18
EPS
23 Oct 2023 Date
0.3
Cons. EPS
0.2
EPS

Han's Laser Technology Industry Group Co., Ltd. (002008) FAQ

What is the stock price today?

The current price is ¥23.36.

On which exchange is it traded?

Han's Laser Technology Industry Group Co., Ltd. is listed on XSHE.

What is its stock symbol?

The ticker symbol is 002008.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, the market cap is 24.52B.

Has Han's Laser Technology Industry Group Co., Ltd. ever had a stock split?

No, there has never been a stock split.

Han's Laser Technology Industry Group Co., Ltd. Profile

Specialty Industrial Machinery Industry
Industrials Sector
Mr. Yun Feng Gao CEO
XSHE Exchange
CNE000001JQ1 ISIN
CN Country
16,866 Employees
- Last Dividend
15 Jun 2011 Last Split
11 Jun 2004 IPO Date

Overview

Han's Laser Technology Industry Group Co., Ltd., operating both domestically and internationally, specializes in the development, production, and sale of advanced laser processing equipment. Since its inception in 1996 and subsequent renaming from Han's Laser Technology Co., Ltd. in November 2014, the company has grown to become a globally recognized leader in the laser technology sector. With its headquarters in Shenzhen, People's Republic of China, Han's Laser has cemented its role as a critical supplier of laser technology solutions across various industries. The company also prides itself on offering comprehensive equipment installation and after-sales services, ensuring clients receive continuous support for their laser technology needs.

Products and Services

  • Ultraviolet and Ultrafast Lasers: These lasers are designed for applications requiring high precision and minimal thermal impact on the material being processed.
  • High Power Fiber Lasers: Ideal for cutting, welding, and other applications requiring high energy efficiency and beam quality.
  • Medium and Low Power CO2 Lasers: Suited for non-metal materials cutting, engraving, and marking thanks to their versatility and quality output.
  • Pulsed Fiber Lasers: Known for their reliability in marking and micro-machining applications across a variety of materials.
  • Laser Devices and General Motion Control Systems: Includes galvanometers, vibrating mirrors, and servo motors, aimed at enhancing precision and control in laser processing.
  • Special Laser Marking Equipment: Provides solutions for unique marking requirements across different materials and surfaces.
  • Laser Welding Equipment: Offers precision welding capabilities for a wide range of industrial applications.
  • Laser Drilling Equipment: Designed for creating precise holes in various materials, essential in electronics manufacturing and other industries.
  • Waterproof and Airtight Testing Equipment: Ensures that products meet strict quality standards for water and air resistance.
  • CNC Numerical Control Machine Beds: Provides a stable and precise platform for various CNC machining processes.
  • Laser Direct Imaging Equipment: Critical in the manufacturing of printed circuit boards and other electronic components.
  • Forming and Testing Equipment: Offers a range of solutions for material forming and rigorous quality testing in manufacturing.
  • Battery Assembly and Processing Equipment: Includes technology for homogenization, mixing, coating, rolling, die-cutting, slitting, winding/stacking, liquid injection, and chemical composition analysis, crucial for the new energy sector.
  • Semiconductor Manufacturing Equipment: Featuring laser boron doping, vapor deposition, and cutting equipment tailored for the semiconductor industry.
  • Front-end Wafer Processing Equipment: Provides tools for surface cutting, internal modification, and other essential wafer processing tasks.
  • Back-end Packaging and Testing Equipment: Offers tools for wire bonding, solid crystal formation, and testing tape applications, supporting the final stages of semiconductor production.

The comprehensive range of products and services offered by Han's Laser Technology Industry Group Co., Ltd. caters to the electronics and semiconductor industries, mechanical hardware, new energy, packaging, brittle material industries, auto industry, sheet metal sectors, and more, demonstrating the company's extensive expertise and capacity in laser technology solutions.

Contact Information

Address: Han's Laser Technology Centre, Shenzhen, China, 518057
Phone: 86 755 8663 2700