| Specialty Retail Industry | Consumer Discretionary Sector | Mr. Seh Meng Lee CEO | XKLS Exchange | MYL5289OO003 ISIN |
| MY Country | 242 Employees | 5 Dec 2025 Last Dividend | 25 Mar 2021 Last Split | - IPO Date |
Techbond Group Berhad, established in 1992 and headquartered in Shah Alam, Malaysia, is a dynamic entity within the adhesive and sealant industry. This esteemed company has carved a niche for itself in both the domestic and international markets, including countries such as Vietnam, Indonesia, and China. A subsidiary of Sonicbond Sdn. Bhd., Techbond Group Berhad takes pride in manufacturing, trading, and developing a wide range of industrial adhesives and sealants. The company’s repertoire of products caters to diverse industrial requirements, bolstering manufacturing processes across various sectors. By exporting its products, Techbond has established a global footprint, underscoring its commitment to quality and innovation in the increasingly competitive adhesives and sealants market.
Techbond Group Berhad offers an extensive portfolio of products and services tailored to meet the nuanced needs of its industrial clients. Here is a closer look: