5469

HannStar Board Corporation (5469)

Market Open
28 Jul, 05:30
TWSE TWSE
NT$
71. 70
+2.4
+3.46%
NT$
28.87B Market Cap
- P/E Ratio
3.2% Div Yield
14,459,097 Volume
- Eps
NT$ 69.3
Previous Close
Day Range
68.7 73.3
Year Range
38.75 73.3
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Summary

5469 trading today higher at NT$71.7, an increase of 3.46% from yesterday's close, completing a monthly increase of 5.6% or NT$3.8. Over the past 12 months, 5469 stock gained 35.54%.
5469 pays dividends to its shareholders, with the most recent payment made on Jul 25, 2025. The next estimated payment will be in In 5 months on Jan 25, 2026 for a total of NT$2.52472.
The last earnings report, released on Jun 18, 2025, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
HannStar Board Corporation has completed 2 stock splits, with the recent split occurring on Oct 09, 2024.
The company's stock is traded on 1 different exchanges and in various currencies, with the primary listing on TWSE (TWD).

5469 Chart

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HannStar Board Corporation Dividends

5469
5469 In 5 months
Estimated
Semi Annual
NT$2.52 Per Share
5469
5469 2 weeks ago
Paid
Semi Annual
NT$2.52 Per Share
5469
5469 19 Jul 2023
Other
NT$2.4 Per Share
5469
5469 9 Aug 2022
Other
NT$2.2 Per Share
5469
5469 12 Aug 2021
Other
NT$2.2 Per Share
5469
5469 23 Jul 2020
Other
NT$1.67 Per Share

HannStar Board Corporation Earnings

18 Jun 2025 Date
-
Cons. EPS
-
EPS
18 Jun 2024 Date
-
Cons. EPS
-
EPS
22 Feb 2024 Date
-
Cons. EPS
-
EPS
30 Oct 2023 Date
2.22
Cons. EPS
1.95
EPS
26 Oct 2016 Date
0.88
Cons. EPS
0.91
EPS
5469
5469 In 5 months
Estimated
Semi Annual
NT$2.52 Per Share
5469
5469 2 weeks ago
Paid
Semi Annual
NT$2.52 Per Share
5469
5469 19 Jul 2023
Other
NT$2.4 Per Share
5469
5469 9 Aug 2022
Other
NT$2.2 Per Share
5469
5469 12 Aug 2021
Other
NT$2.2 Per Share
5469
5469 23 Jul 2020
Other
NT$1.67 Per Share
18 Jun 2025 Date
-
Cons. EPS
-
EPS
18 Jun 2024 Date
-
Cons. EPS
-
EPS
22 Feb 2024 Date
-
Cons. EPS
-
EPS
30 Oct 2023 Date
2.22
Cons. EPS
1.95
EPS
26 Oct 2016 Date
0.88
Cons. EPS
0.91
EPS

HannStar Board Corporation (5469) FAQ

What is the stock price today?

The current price is NT$71.70.

On which exchange is it traded?

HannStar Board Corporation is listed on TWSE.

What is its stock symbol?

The ticker symbol is 5469.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 3.2%.

What is its market cap?

As of today, the market cap is 28.87B.

Has HannStar Board Corporation ever had a stock split?

HannStar Board Corporation had 2 splits and the recent split was on Oct 09, 2024.

HannStar Board Corporation Profile

Electronic Components Industry
Technology Sector
Mr. Yu-Heng Chiao CEO
TWSE Exchange
TW0005469001 ISIN
TW Country
- Employees
9 Jul 2025 Last Dividend
9 Oct 2024 Last Split
- IPO Date

Overview

HannStar Board Corporation is a distinguished manufacturer, assembler, and seller of printed circuit boards (PCBs) based in Taiwan. Originating in 1989 under the name Pacific Science and Technology Industrial Co., Ltd., the company underwent a rebranding in December 1998 to become known as HannStar Board Corporation. With its headquarters in Taoyuan, Taiwan, HannStar has carved out a significant presence in the global market by providing innovative PCB solutions. Catering to a diverse range of industries including gaming, consumer electronics, computing, automotive, and networking, the company has established itself as a leader in the PCB manufacturing domain.

Products and Services

  • Double-Sided PCBs
  • These are PCBs with circuits on both sides, offering flexibility in design and more circuitry in a smaller space. They are widely used across various applications owing to their versatility and efficiency.

  • Multi-Layer PCBs
  • Comprising several layers of circuit boards stacked together, these PCBs are designed for complex applications requiring high-speed circuitry, large capacity, and small form factors. They are essential in computing, communication devices, and advanced consumer electronics.

  • Thick Copper PCBs
  • These PCBs are characterized by their thick copper conductors, which are ideal for high power distribution applications, such as in industrial controls, automotive power systems, and power supply modules. The thick copper layer ensures robust current carrying capacity and heat dissipation.

  • High-Density Interconnect (HDI) PCBs
  • HDI PCBs are known for their high-density attributes, including finer lines and spaces, smaller vias, and higher connection pad density. This technology enables more advanced features in a smaller area, critical for modern high-tech devices like smartphones and wearable technologies.

  • SLC Multi-Layer PCBs
  • Standing for Sequential Lamination Construction, these multi-layer PCBs are built by sequentially laminating layers of circuits on top of each other. This process allows for higher component density and better electrical performance, making them suitable for high-end servers, network equipment, and complex consumer electronics.

Contact Information

Address: No. 9, Gongye 4th Road, Taoyuan City, Taiwan, 328
Phone: 886 3 483 8500