Summary
ChipMOS TECHNOLOGIES INC. (IMOS) Q2 2025 Earnings Call Transcript
ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS ) Q2 2025 Earnings Conference Call August 12, 2025 3:00 AM ET Company Participants G.
ChipMOS Technologies: Could Soon Show The Path Ahead
ChipMOS TECHNOLOGIES has been looking for directions lately, but a catalyst may not be so far away, which could send it lower or, alternatively, higher. The charts suggest the stock has been retracing prior moves, but it likely needs a catalyst to get past what is likely to be resistance. Long IMOS has arguments in its favor, which include dividend payouts and valuations that are on the low side, if not undervalued.
ChipMOS TECHNOLOGIES INC. (IMOS) Q1 2025 Earnings Call Transcript
ChipMOS TECHNOLOGIES INC. (NASDAQ:IMOS ) Q1 2025 Earnings Conference Call May 13, 2025 3:00 AM ET Company Participants GS Shen – Strategy and Investor Relations S.J.
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ChipMOS Technologies Inc. Profile
| Semiconductors & Semiconductor Equipment Industry | Information Technology Sector | Shih-Jye Cheng CEO | NASDAQ (NGS) Exchange | 16965P103 CUSIP |
| TW Country | 5,688 Employees | 27 Jun 2025 Last Dividend | 31 Oct 2016 Last Split | - IPO Date |
Overview
ChipMOS TECHNOLOGIES INC. is a leading provider in the semiconductor industry, dedicated to the research, development, manufacturing, and sales of high-integration and high-precision integrated circuits, along with related assembly and testing services. With operations spanning the People's Republic of China, Japan, Singapore, and other global markets, the company delivers comprehensive solutions through its diverse service segments including Testing, Assembly, Testing and Assembly for LCD, OLED, and Other Display Panel Driver Semiconductors, Bumping, and Others. Founded in 1997 and headquartered in Hsinchu, Taiwan, ChipMOS has solidified its presence in the semiconductor sector by catering to a wide array of applications from personal computing and graphics to communications, mobile products, and automotive/industrial display panels.
Products and Services
ChipMOS TECHNOLOGIES INC. offers a wide range of back-end assembly and testing services vital to the semiconductor industry:
- Engineering Test, Wafer Probing, and Final Test: Specialized services for both memory and logic/mixed-signal semiconductors, focusing on ensuring the performance and reliability of the chips before they go to market.
- Leadframe-based and Organic Substrate-based Package Assembly: Provides essential assembly services for memory and logic/mixed-signal semiconductors, utilizing both leadframe and organic substrate technologies to meet different requirement and application needs.
- Gold Bumping: Offers gold bumping services, a critical process for creating connections on chips before they are packaged, which is essential for LCD, OLED, and other display drivers.
- Reel to Reel Assembly and Test Services: Tailored for LCD, OLED, and other panel display driver semiconductors, these services ensure that display technologies meet the stringent quality requirements before integration into consumer products.
The range of services offered by ChipMOS caters to a broad scope of applications, including but not limited to personal computers, gaming consoles, communications equipment, mobile devices like cellular handsets and tablets, consumer electronics, as well as automotive and industrial display applications. This extensive portfolio highlights ChipMOS’s commitment to supporting the evolving needs of the semiconductor industry with high-quality, precision-driven solutions.
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