0021

Tianjin Printronics Circuit Corporation 002134

Market Closed
30 Sep, 06:57
XSHE XSHE
¥
9. 34
+0.72
+8.35%
¥
2.3B Market Cap
121.89 P/E Ratio
0% Div Yield
18,042,644 Volume
0 Eps
¥ 8.62
Previous Close
Day Range
8.63 9.43
Year Range
5.46 11.2

002134 Chart

Tianjin Printronics Circuit Corporation Profile

Semiconductors Industry
Technology Sector
Mr. Dong Pang CEO
XSHE Exchange
CNE1000000N3 ISIN
CN Country
1,518 Employees
- Last Dividend
30 May 2008 Last Split
16 May 2007 IPO Date

Overview

Tianjin Printronics Circuit Corporation, founded in 1988 and based in Tianjin, People's Republic of China, operates in the field of Printed Circuit Board (PCB) manufacturing. It distinguishes itself through its capacity to produce a vast array of PCBs, catering to different technological requirements across various industries such as industrial automation control, telecommunication, aviation and aerospace, automotive electronics, IT, instrument and meters, medical devices, and consumer electronics. The company's strength lies in its comprehensive product offerings from standard boards to complex HDI and rigid flex boards, coupled with its black solder mask technology for enhanced performance. Emphasizing innovation, quality, and customer satisfaction, Tianjin Printronics Circuit Corporation leverages its expertise to contribute to the PCB industry, positioning itself both as a domestic leader and a global exporter.

Products and Services

Tianjin Printronics Circuit Corporation provides a wide range of PCB products and services designed to meet the diverse needs of its clientele. Here is an exploration of its main offerings:

  • Multi-layer Board with Black Solder Mask: A specialty product designed for applications requiring low reflections or a distinctive appearance. The black solder mask improves heat dissipation and contrasts sharply with silkscreened labels for better readability.
  • 1 and 2 Step HDI Boards: High-Density Interconnector (HDI) boards that facilitate higher component density and more reliable electrical performance. These boards are particularly suitable for advanced electronic devices, ranging from smartphones to aerospace components.
  • Step HDIs with Fine Pitch: These boards cater to products requiring exceptionally fine pitch components, enabling more compact and sophisticated electronic assemblies. They are crucial for high-end computing and telecommunications equipment.
  • 16-Layer Boards: Designed for complex electronic systems, these boards provide multiple layers for intricate circuit designs, accommodating a vast network of connections within a compact form factor. They are ideal for servers, military, and aerospace electronics that demand high performance and reliability.
  • Military High Layer Boards: Tailored for defense applications, these boards meet stringent quality and durability standards. They are engineered to withstand extreme conditions while ensuring consistent performance in critical military hardware.
  • Power Supply Boards: Focused on delivering and managing power within electronic devices, these boards are built to ensure stability and efficiency. They are crucial for any hardware requiring reliable power distribution, from consumer electronics to industrial machinery.
  • Normal Boards: Covering standard PCB requirements, these boards cater to a wide range of electronic products, offering versatility and cost-effectiveness for general applications.
  • 10-Layer Rigid Flex Boards: Combining rigid and flexible PCB technologies, these boards provide enhanced adaptability and reliability for complex electronics that require connections in constrained spaces or movable parts.
  • Rigid Flex Boards: These boards offer a mix of flexibility and rigidity, suitable for dynamic applications where durability and form factor are critical. They are commonly used in portable electronics and medical devices.
  • 1-Side 2-Layer Aluminum Boards: These boards are designed for high power LED applications and electronics requiring effective heat dissipation. Aluminum backing serves as an excellent heat sink, prolonging the lifespan of components.
  • Step Board, Immersive Silver and Tin Surface: Providing options for surface finishing, these treatments enhance solderability and corrosion resistance, ensuring long-term reliability for PCBs in various environments.
  • Multi-layer PCB: The backbone of modern electronics, these boards support complex circuits with multiple layers, enabling the integration of more functions into smaller footprints. They are foundational in most advanced electronic devices today.

Contact Information

Address: Tianjin Pilot Free Trade Zone, Tianjin, China, 300308
Phone: 86 22 2489 5666