0013

Shenzhen Techwinsemi Technology Co., Ltd. (001309)

Market Closed
12 Dec, 06:57
XSHE XSHE
¥
214. 76
-2.33
-1.07%
¥
49.89B Market Cap
32.73 P/E Ratio
0.86% Div Yield
11,407,888 Volume
0 Eps
¥ 217.09
Previous Close
Day Range
206.41 221
Year Range
78.79 306
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Summary

001309 closed Friday lower at ¥214.76, a decrease of 1.07% from Thursday's close, completing a monthly increase of 5.43% or ¥11.06. Over the past 12 months, 001309 stock gained 245.27%.
001309 pays dividends to its shareholders, with the most recent payment made on Jul 10, 2025. The next estimated payment will be in In 6 months on Jul 10, 2026 for a total of ¥0.3.
The last earnings report, released on Apr 29, 2024, exceeded the consensus estimates by 1.34%. On average, the company has surpassed earnings expectations by 0.76%, based on the last three reports.
Shenzhen Techwinsemi Technology Co., Ltd. has completed 3 stock splits, with the recent split occurring on Jul 10, 2025.
The company's stock is traded on 1 different exchanges and in various currencies, with the primary listing on XSHE (CNY).

001309 Chart

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Shenzhen Techwinsemi Technology Co., Ltd. (001309) FAQ

What is the stock price today?

The current price is ¥214.76.

On which exchange is it traded?

Shenzhen Techwinsemi Technology Co., Ltd. is listed on XSHE.

What is its stock symbol?

The ticker symbol is 001309.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.86%.

What is its market cap?

As of today, the market cap is 49.89B.

Has Shenzhen Techwinsemi Technology Co., Ltd. ever had a stock split?

Shenzhen Techwinsemi Technology Co., Ltd. had 3 splits and the recent split was on Jul 10, 2025.

Shenzhen Techwinsemi Technology Co., Ltd. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Mr. Hu Li CEO
XSHE Exchange
- ISIN
CN Country
884 Employees
- Last Dividend
10 Jul 2025 Last Split
- IPO Date

Overview

Shenzhen Techwinsemi Technology Co., Ltd., founded in 2008 and based in Shenzhen, China, is a pioneering entity in the integrated circuit sector. It specializes in the design, research, and development of integrated circuits with a strong emphasis on industrial applications. The company focuses on crafting innovative storage module product and application solutions, catering to a diverse industrial clientele. Its core competencies lie in the development and optimization of flash memory main control chips, alongside the production and sale of storage module products. Shenzhen Techwinsemi Technology Co., Ltd. adeptly serves a variety of sectors including industrial equipment, automotive and consumer electronics, household appliances, the Internet of Things, data centers, and more, showcasing its broad purview and versatility in the technology domain.

Products and Services

The portfolio of Shenzhen Techwinsemi Technology Co., Ltd. encompasses an expansive range of products and services designed to meet the ever-evolving needs of the technology and electronics sectors. These offerings include:

  • Memory Card and Storage Disk Module: These products offer reliable data storage solutions, catering to a wide range of electronic devices. They are designed for durability and performance, ensuring data integrity and speed.
  • Solid State Drive (SSD) and Embedded Storage Products: Providing faster data access and increased reliability compared to traditional hard disk drives, these SSDs and embedded storage solutions are critical for enhancing the performance of computers, industrial systems, and consumer electronics.

Contact Information

Address: Building 1, Block A, Shenzhen New Generation Industrial Park, Shenzhen City, China, 518000
Phone: 86 755 2357 9117