Tianshui Huatian Technology Co., Ltd. (002185)

Overview

Tianshui Huatian Technology Co., Ltd., established in 2003, is a leading provider of integrated circuit packaging and testing services, operating both domestically within India and on an international scale. Headquartered in Tianshui, China, the company has made significant strides in the semiconductor industry, offering a wide range of high-quality services tailored to meet the evolving needs of its clients in the electronics sector.

Products and Services

• Lead Frame Packaging Products
  

  These involve the encapsulation of semiconductor devices with a metal frame that serves both as a mechanical support and a means of electrical connection to the printed circuit board. This technology is widely used for its reliability and cost-effectiveness.

• Substrate Packaging Products
  

  Substrate packaging offers a platform for integrating multiple semiconductor devices, providing mechanical support and routing electrical connections. This approach is essential for complex circuits and is pivotal in advancing miniaturization and performance enhancements in electronics.

• Flip Chip Packaging Products
  

  By connecting semiconductor devices directly to the substrate or circuit board, flip chip technology significantly reduces package size and improves performance. This method is crucial for modern, high-density electronic devices.

• System-in-Package (SiP)
  

  Combining multiple integrated circuits into a single package, SiP technology enables the delivery of complete system functionality in a compact form. This integration reduces the footprint of electronic components, facilitating the development of smaller, more powerful devices.

• Bumping and Wafer Level Products
  

  Focused on the creation of solder bumps on the wafer surface, this technology is fundamental for flip chip attachments. It plays a critical role in the assembly process of semiconductor devices, offering precision and scalability.

• MEMS and Sensors
  

  Offering packaging solutions for Micro-Electro-Mechanical Systems (MEMS) and sensors, Tianshui Huatian Technology Co., Ltd. caters to a wide array of industries, including automotive, consumer electronics, and healthcare, providing tailored encapsulation that meets the unique demands of these delicate systems.

• Testing Services
  

  The company provides comprehensive testing services to ensure the functionality, reliability, and performance of integrated circuits and electronic components, adhering to the highest industry standards.

• Co-Design Simulation Services
  

  These services involve close collaboration with clients to simulate and optimize the packaging and integration of semiconductor devices, ensuring the best possible performance and compatibility with existing systems.