8027

E&R Engineering Corporation (8027)

Market Open
17 Dec, 05:30
TWSE TWSE
NT$
112. 50
+4.5
+4.17%
NT$
9.53B Market Cap
- P/E Ratio
2% Div Yield
3,182,605 Volume
- Eps
NT$ 108
Previous Close
Day Range
108.5 116.5
Year Range
54.8 116
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Summary

8027 trading today higher at NT$112.5, an increase of 4.17% from yesterday's close, completing a monthly increase of 8.7% or NT$9. Over the past 12 months, 8027 stock gained 29.76%.
8027 is not paying dividends to its shareholders.
The stock of the company had never split.
The company's stock is traded on 1 different exchanges and in various currencies, with the primary listing on TWSE (TWD).

8027 Chart

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E&R Engineering Corporation (8027) FAQ

What is the stock price today?

The current price is NT$112.50.

On which exchange is it traded?

E&R Engineering Corporation is listed on TWSE.

What is its stock symbol?

The ticker symbol is 8027.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 2%.

What is its market cap?

As of today, the market cap is 9.53B.

Has E&R Engineering Corporation ever had a stock split?

No, there has never been a stock split.

E&R Engineering Corporation Profile

Machinery Industry
Industrials Sector
Mr. Eric Chang CEO
TWSE Exchange
- ISIN
Taiwan Country
- Employees
- Last Dividend
1 Oct 2019 Last Split
- IPO Date

Overview

E&R Engineering Corporation is an established name in the automation machines sector, catering specifically to industries such as semiconductor, LED, passive components, materials, and medical in Taiwan. Founded in 1994 and based in Kaohsiung, Taiwan, the company has carved a niche for itself through the provision of cutting-edge laser solutions and plasma technology products. E&R Engineering Corporation is not just known for its high-quality products but also for its comprehensive workshop and laser process development services, ensuring clients receive end-to-end solutions for their automation needs.

Products and Services

  • Laser Solutions: This category encompasses a broad range of applications including wafer and package marking, offering high precision in identification processes. Additionally, E&R Engineering excels in micromachining services such as laser drilling, cutting, scribing, and grooving solutions designed for intricate manufacturing requirements.
  • Plasma Technology Products: Providing advanced solutions in both wafer and panel forms, as well as L/F substrates, these products leverage plasma technology for various manufacturing processes, enhancing efficiency and quality in production lines.
  • FPC Equipment: This includes a wide array of machines such as Roll-To-Roll (RTR), Sheet-To-Sheet (STS), lamination, punch, plating, and open cover machines tailored for the flexible printed circuits (FPC) industry, reflecting the company’s expertise in catering to specific industry needs.
  • Embossed Carrier Tape, Cover Tape, and E&R Tape and Reel Products: Focusing on the packaging segment, these products provide secure and reliable packaging solutions for the semiconductor and electronic components industries. The offerings are designed to protect and handle sensitive components during the transportation and assembly processes.
  • Workshop and Laser Process Development Services: Beyond the hardware, E&R Engineering Corporation offers holistic services aimed at developing efficient laser processes and conducting workshops to empower clients with the knowledge and skills needed for optimizing their operations.

Contact Information

Address: 61, Hengsang Road
Phone: 886 7 615 6600