BE Semiconductor Industries N.V. (OTC:BESIY) Q3 2025 Earnings Call October 23, 2025 10:00 AM EDT Company Participants Richard Blickman - Chairman of Management Board, President & CEO Conference Call Participants Didier Scemama - BofA Securities, Research Division Sandeep Deshpande - JPMorgan Chase & Co, Research Division Ruben Devos - Kepler Cheuvreux, Research Division Yu Shi - Needham & Company, LLC, Research Division Andrew Gardiner - Citigroup Inc., Research Division Timm Schulze-Melander - Rothschild & Co Redburn, Research Division Martin Jungfleisch - BNP Paribas Exane, Research Division Adithya Metuku - HSBC Global Investment Research Presentation Operator Good morning, good afternoon, ladies and gentlemen, and welcome to Besi's conference call and audio webcast to discuss the company's 2025 third quarter results.
BE Semiconductor Industries is a key player in die-attach and packaging equipment, critical for advanced chip manufacturing. BESIY benefits from AI-driven chip demand and leads in advanced die attach but faces cyclicality and recent revenue softness. Despite weak near-term guidance and high valuation, BESIY is poised for significant growth from 2026-2028 as advanced packaging demand accelerates.
BESIY, CCS and CAG have been added to the Zacks Rank #5 (Strong Sell) List on September 18, 2025.
| Semiconductors & Semiconductor Equipment Industry | Information Technology Sector | Mr. Richard W. Blickman CEO | OTC PINK Exchange | 073320103 CUSIP |
| NL Country | 1,820 Employees | 28 Apr 2025 Last Dividend | 10 May 2018 Last Split | - IPO Date |
BE Semiconductor Industries N.V., often abbreviated as BE Semiconductor or BESI, is a leading entity in the semiconductor assembly equipment sector, catering to both the semiconductor and electronics industries globally. Its operations are widespread, involving significant markets such as China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, various other Asia Pacific locations, and Europe. Founded in 1995 and based in Duiven, the Netherlands, BESI has established itself through its innovative approach in the development, manufacturing, marketing, sale, and service of semiconductor assembly tools. The company’s business activities are organized into three primary segments: Die Attach, Packaging, and Plating, addressing the comprehensive needs of multinational chip manufacturers, assembly subcontractors, and a broad spectrum of companies within the electronics and industrial domains.
This category includes a range of sophisticated machinery designed for various assembly processes such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems. These tools are critical for ensuring precise component placement and reliable interconnections in semiconductor devices.
BESI provides advanced packaging solutions encompassing conventional, ultra-thin, and wafer level molding machines, in addition to trim and form, and singulation systems. These systems are vital for the encapsulation and protection of semiconductor chips, addressing the needs for miniaturization and enhanced performance of electronic devices.
The plating equipment portfolio includes systems for tin, copper, precious metal, and solar plating, complemented by a selection of related process chemicals. These solutions are integral to the fabrication of semiconductor devices, offering critical functionalities such as the formation of conductive pathways and enhancing the durability of components.
Beyond its main products, BESI provides an extensive range of supporting services and products, including tooling, conversion kits for equipment upgrades or modifications, and a broad assortment of spare parts. The company also offers comprehensive services to ensure the optimal performance and longevity of its equipment, enhancing customer satisfaction and operational efficiency.