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Besi Semiconductors Industries N.V. (BSIA)

Market Closed
18 Sep, 20:00
XFRA XFRA
187. 00
+11
+6.25%
9.05B Market Cap
- P/E Ratio
8.6% Div Yield
3 Volume
- Eps
176
Previous Close
Add Transaction
Day Range
179 187
Year Range
112 336
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Summary

BSIA closed yesterday higher at €187, an increase of 6.25% from Thursday's close, completing a monthly decrease of -4.1026% or -€8. Over the past 12 months, BSIA stock gained 38.5185%.
BSIA pays dividends to its shareholders, with the most recent payment made on May 14, 2026. The next estimated payment will be in In 7 months on May 14, 2027 for a total of €1.84765.
The last earnings report, released on Apr 21, 2026, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
Besi Semiconductors Industries N.V. has completed 1 stock splits, with the recent split occurring on May 10, 2018.
The company's stock is traded on 4 different exchanges and in various currencies, with the primary listing on OTC PINK (USD).

BSIA Chart

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Is BE Semiconductor Industries (BESIY) Stock Outpacing Its Computer and Technology Peers This Year?

Is BE Semiconductor Industries (BESIY) Stock Outpacing Its Computer and Technology Peers This Year?

Here is how BE Semiconductor Industries NV (BESIY) and ACM Research, Inc. (ACMR) have performed compared to their sector so far this year.

Zacks | 2 weeks ago
BE Semiconductor: Hybrid Bonding Is Becoming AI's Next Bottleneck

BE Semiconductor: Hybrid Bonding Is Becoming AI's Next Bottleneck

BE Semiconductor is uniquely positioned at the precision bottleneck in advanced semiconductor packaging, benefiting from AI-driven demand and hybrid bonding adoption. Recent results show a production ramp: Q2 revenue up 68.7% YoY, orders up 128.8%, gross margin at 65.7%, and net margin at 35.6%. I project FY revenue of €1.0B, with a base-case FY+1 of €1.4B and $7.8 EPS/ADR, supporting a Buy rating and a ~$275 price target.

Seekingalpha | 2 weeks ago
Is BE Semiconductor Industries (BESIY) Outperforming Other Computer and Technology Stocks This Year?

Is BE Semiconductor Industries (BESIY) Outperforming Other Computer and Technology Stocks This Year?

Here is how BE Semiconductor Industries NV (BESIY) and ACM Research, Inc. (ACMR) have performed compared to their sector so far this year.

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Besi Semiconductors Industries N.V. (BSIA) FAQ

What is the stock price today?

The current price is €187.00.

On which exchange is it traded?

Besi Semiconductors Industries N.V. is listed on XFRA.

What is its stock symbol?

The ticker symbol is BSIA.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 8.6%.

What is its market cap?

As of today, the market cap is 9.05B.

Has Besi Semiconductors Industries N.V. ever had a stock split?

Besi Semiconductors Industries N.V. had 1 splits and the recent split was on May 10, 2018.

Besi Semiconductors Industries N.V. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Richard W. Blickman CEO
XFRA Exchange
073320103 CUSIP
NL Country
1,856 Employees
28 Apr 2026 Last Dividend
10 May 2018 Last Split
- IPO Date

Overview

BE Semiconductor Industries N.V., often abbreviated as BE Semiconductor or BESI, is a leading entity in the semiconductor assembly equipment sector, catering to both the semiconductor and electronics industries globally. Its operations are widespread, involving significant markets such as China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, various other Asia Pacific locations, and Europe. Founded in 1995 and based in Duiven, the Netherlands, BESI has established itself through its innovative approach in the development, manufacturing, marketing, sale, and service of semiconductor assembly tools. The company’s business activities are organized into three primary segments: Die Attach, Packaging, and Plating, addressing the comprehensive needs of multinational chip manufacturers, assembly subcontractors, and a broad spectrum of companies within the electronics and industrial domains.

Products and Services

  • Die Attach Equipment

    This category includes a range of sophisticated machinery designed for various assembly processes such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems. These tools are critical for ensuring precise component placement and reliable interconnections in semiconductor devices.

  • Packaging Equipment

    BESI provides advanced packaging solutions encompassing conventional, ultra-thin, and wafer level molding machines, in addition to trim and form, and singulation systems. These systems are vital for the encapsulation and protection of semiconductor chips, addressing the needs for miniaturization and enhanced performance of electronic devices.

  • Plating Equipment

    The plating equipment portfolio includes systems for tin, copper, precious metal, and solar plating, complemented by a selection of related process chemicals. These solutions are integral to the fabrication of semiconductor devices, offering critical functionalities such as the formation of conductive pathways and enhancing the durability of components.

  • Tooling, Conversion Kits, Spare Parts, and Services

    Beyond its main products, BESI provides an extensive range of supporting services and products, including tooling, conversion kits for equipment upgrades or modifications, and a broad assortment of spare parts. The company also offers comprehensive services to ensure the optimal performance and longevity of its equipment, enhancing customer satisfaction and operational efficiency.

Contact Information

Address: Ratio 6
Phone: 31 26 319 4500