![]() BSIA 2 months ago | Other | €2.14 Per Share |
![]() BSIA 29 Apr 2024 | Other | €1.97 Per Share |
![]() BSIA 2 May 2023 | Other | €2.67 Per Share |
![]() BSIA 3 May 2022 | Other | €3 Per Share |
![]() BSIA 2 May 2022 | Other | €3.2 Per Share |
23 Jul 2025 (In 2 weeks) Date | | - Cons. EPS | - EPS |
23 Apr 2025 Date | | - Cons. EPS | - EPS |
20 Feb 2025 Date | | - Cons. EPS | - EPS |
24 Oct 2024 Date | | - Cons. EPS | - EPS |
25 Jul 2024 Date | | - Cons. EPS | - EPS |
![]() BSIA 2 months ago | Other | €2.14 Per Share |
![]() BSIA 29 Apr 2024 | Other | €1.97 Per Share |
![]() BSIA 2 May 2023 | Other | €2.67 Per Share |
![]() BSIA 3 May 2022 | Other | €3 Per Share |
![]() BSIA 2 May 2022 | Other | €3.2 Per Share |
23 Jul 2025 (In 2 weeks) Date | | - Cons. EPS | - EPS |
23 Apr 2025 Date | | - Cons. EPS | - EPS |
20 Feb 2025 Date | | - Cons. EPS | - EPS |
24 Oct 2024 Date | | - Cons. EPS | - EPS |
25 Jul 2024 Date | | - Cons. EPS | - EPS |
Semiconductors Industry | Technology Sector | Mr. Richard W. Blickman CEO | XFRA Exchange | US0733201034 ISIN |
NL Country | 1,820 Employees | 28 Apr 2025 Last Dividend | - Last Split | - IPO Date |
BE Semiconductor Industries N.V., often abbreviated as BE Semiconductor or BESI, is a leading entity in the semiconductor assembly equipment sector, catering to both the semiconductor and electronics industries globally. Its operations are widespread, involving significant markets such as China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, various other Asia Pacific locations, and Europe. Founded in 1995 and based in Duiven, the Netherlands, BESI has established itself through its innovative approach in the development, manufacturing, marketing, sale, and service of semiconductor assembly tools. The company’s business activities are organized into three primary segments: Die Attach, Packaging, and Plating, addressing the comprehensive needs of multinational chip manufacturers, assembly subcontractors, and a broad spectrum of companies within the electronics and industrial domains.
This category includes a range of sophisticated machinery designed for various assembly processes such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems. These tools are critical for ensuring precise component placement and reliable interconnections in semiconductor devices.
BESI provides advanced packaging solutions encompassing conventional, ultra-thin, and wafer level molding machines, in addition to trim and form, and singulation systems. These systems are vital for the encapsulation and protection of semiconductor chips, addressing the needs for miniaturization and enhanced performance of electronic devices.
The plating equipment portfolio includes systems for tin, copper, precious metal, and solar plating, complemented by a selection of related process chemicals. These solutions are integral to the fabrication of semiconductor devices, offering critical functionalities such as the formation of conductive pathways and enhancing the durability of components.
Beyond its main products, BESI provides an extensive range of supporting services and products, including tooling, conversion kits for equipment upgrades or modifications, and a broad assortment of spare parts. The company also offers comprehensive services to ensure the optimal performance and longevity of its equipment, enhancing customer satisfaction and operational efficiency.