Besi Semiconductors Industries N.V. logo

Besi Semiconductors Industries N.V. (BSIA)

Market Open
1 Jul, 06:04
XFRA XFRA
123. 00
-3
-2.38%
9.05B Market Cap
- P/E Ratio
8.6% Div Yield
0 Volume
- Eps
126
Previous Close
Day Range
123 123
Year Range
79.5 167
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Earnings results expected in 20 days

Summary

BSIA trading today lower at €123, a decrease of 2.38% from yesterday's close, completing a monthly increase of 0% or €0. Over the past 12 months, BSIA stock lost -4.65%.
BSIA is not paying dividends to its shareholders.
The last earnings report, released on Apr 23, 2025, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports. The next scheduled earnings report is due on Jul 23, 2025.
The stock of the company had never split.
The company's stock is traded on 3 different exchanges and in various currencies, with the primary listing on XFRA (EUR).

BSIA Chart

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Besi Semiconductors Industries N.V. Dividends

Besi Semiconductors Industries N.V. logo
BSIA 2 months ago
Other
€2.14 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 29 Apr 2024
Other
€1.97 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 2 May 2023
Other
€2.67 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 3 May 2022
Other
€3 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 2 May 2022
Other
€3.2 Per Share

Besi Semiconductors Industries N.V. Earnings

23 Jul 2025 (In 2 weeks) Date
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Cons. EPS
-
EPS
23 Apr 2025 Date
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Cons. EPS
-
EPS
20 Feb 2025 Date
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Cons. EPS
-
EPS
24 Oct 2024 Date
-
Cons. EPS
-
EPS
25 Jul 2024 Date
-
Cons. EPS
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EPS
Besi Semiconductors Industries N.V. logo
BSIA 2 months ago
Other
€2.14 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 29 Apr 2024
Other
€1.97 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 2 May 2023
Other
€2.67 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 3 May 2022
Other
€3 Per Share
Besi Semiconductors Industries N.V. logo
BSIA 2 May 2022
Other
€3.2 Per Share
23 Jul 2025 (In 2 weeks) Date
-
Cons. EPS
-
EPS
23 Apr 2025 Date
-
Cons. EPS
-
EPS
20 Feb 2025 Date
-
Cons. EPS
-
EPS
24 Oct 2024 Date
-
Cons. EPS
-
EPS
25 Jul 2024 Date
-
Cons. EPS
-
EPS

Besi Semiconductors Industries N.V. (BSIA) FAQ

What is the stock price today?

The current price is €123.00.

On which exchange is it traded?

Besi Semiconductors Industries N.V. is listed on XFRA.

What is its stock symbol?

The ticker symbol is BSIA.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 8.6%.

What is its market cap?

As of today, the market cap is 9.05B.

When is the next earnings date?

The next earnings report will release on Jul 23, 2025.

Has Besi Semiconductors Industries N.V. ever had a stock split?

No, there has never been a stock split.

Besi Semiconductors Industries N.V. Profile

Semiconductors Industry
Technology Sector
Mr. Richard W. Blickman CEO
XFRA Exchange
US0733201034 ISIN
NL Country
1,820 Employees
28 Apr 2025 Last Dividend
- Last Split
- IPO Date

Overview

BE Semiconductor Industries N.V., often abbreviated as BE Semiconductor or BESI, is a leading entity in the semiconductor assembly equipment sector, catering to both the semiconductor and electronics industries globally. Its operations are widespread, involving significant markets such as China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, various other Asia Pacific locations, and Europe. Founded in 1995 and based in Duiven, the Netherlands, BESI has established itself through its innovative approach in the development, manufacturing, marketing, sale, and service of semiconductor assembly tools. The company’s business activities are organized into three primary segments: Die Attach, Packaging, and Plating, addressing the comprehensive needs of multinational chip manufacturers, assembly subcontractors, and a broad spectrum of companies within the electronics and industrial domains.

Products and Services

  • Die Attach Equipment

    This category includes a range of sophisticated machinery designed for various assembly processes such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems. These tools are critical for ensuring precise component placement and reliable interconnections in semiconductor devices.

  • Packaging Equipment

    BESI provides advanced packaging solutions encompassing conventional, ultra-thin, and wafer level molding machines, in addition to trim and form, and singulation systems. These systems are vital for the encapsulation and protection of semiconductor chips, addressing the needs for miniaturization and enhanced performance of electronic devices.

  • Plating Equipment

    The plating equipment portfolio includes systems for tin, copper, precious metal, and solar plating, complemented by a selection of related process chemicals. These solutions are integral to the fabrication of semiconductor devices, offering critical functionalities such as the formation of conductive pathways and enhancing the durability of components.

  • Tooling, Conversion Kits, Spare Parts, and Services

    Beyond its main products, BESI provides an extensive range of supporting services and products, including tooling, conversion kits for equipment upgrades or modifications, and a broad assortment of spare parts. The company also offers comprehensive services to ensure the optimal performance and longevity of its equipment, enhancing customer satisfaction and operational efficiency.

Contact Information

Address: Ratio 6
Phone: 31 26 319 4500