Yunnan Tin Company Limited 000960

Overview

Yunnan Tin Company Limited, established in 1883 and headquartered in Kunming, China, stands as a venerable titan in tin production and processing. As the largest tin producer and exporter in China, the company has carved out a significant niche in the global metals market. Yunnan Tin Company Limited's operations encompass a broad spectrum of activities, including the mining of tin ore, smelting, refining, and producing a wide array of tin-related products. Their expansive product portfolio caters to various industrial applications, showcasing the company's versatility and innovative prowess in leveraging tin's unique properties. The enterprise is also committed to advancing its lead in the industry through continuous research and development efforts, ensuring its offerings are at the forefront of technology and sustainability.

Products and Services

• Tin Ingots: High-purity tin blocks produced for a wide range of manufacturing purposes, including electronics and specialized alloys.
• Special Tins for Float Glass Production: Customized tin solutions designed to enhance the quality and efficiency of float glass manufacturing processes.
• Bearing Alloy Ingots: Tin-based alloys optimized for use in bearings, providing superior performance and longevity.
• Lead-Based Alloys: Alloys combining tin and lead, utilized in various applications where their combined properties are beneficial.
• Tin-Lead Wire Solders: Essential components for the electronics industry, used in soldering to create reliable electrical joints.
• Zinc and Tin Zinc Alloy Wires: Specialty wires that offer corrosion resistance and are used in a variety of applications, including galvanization.
• Lead-Free Solder Wires and Bars: Environmentally friendly soldering materials designed to meet modern sustainability standards.
• Casting Solder Bars: Solder bars that are designed for casting applications, providing consistent quality and performance.
• Extruder Solder Bars: Specifically crafted for use in extrusion processes, offering precision and efficiency.
• Tin Granules and Balls: These small, pure tin forms are used in chemical processes and as components in specialized solders.
• Spherical Solder Powders: Tiny balls of solder that are used in the production of solder paste for surface mount technology (SMT) applications.
• Ball Grid Array (BGA) Solder Balls: Essential for modern electronics manufacturing, these solder balls are used in BGA packaging for integrated circuits.
• Tin and Solder Anodes: Used in electroplating processes to coat objects with a thin layer of tin or solder.
• Lead-Free Solder Pastes: Pastes that facilitate the soldering of electronic components without the use of lead, aligning with global environmental standards.
• Low-Temperature Solder Pastes: Solder pastes that melt and flow at lower temperatures, reducing thermal stress on sensitive components.
• Eutectic Solder Pastes: Pastes that have a specific alloy ratio providing a sharp melting point, used for precise soldering tasks.
• Copper Cathode Products: High-purity copper plates produced as a result of copper electrorefining, used in the manufacturing of various copper products.
• Tin Chemicals: A range of organic and inorganic tin compounds used in industrial processes, including plating and chemical synthesis.
• Indium and Silver Ingots: Pure forms of indium and silver, used in electronic, pharmaceutical, and jewelry industries.