Ningbo Kangqiang Electronics Co., Ltd. (002119)
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Ningbo Kangqiang Electronics Co., Ltd. Profile
| Semiconductors & Semiconductor Equipment Industry | Information Technology Sector | Ms. Fang Zheng CEO | XSHE Exchange | CNE000001R50 ISIN |
| CN Country | 1,087 Employees | 8 May 2026 Last Dividend | 22 Jun 2018 Last Split | 2 Mar 2007 IPO Date |
Overview
Ningbo Kangqiang Electronics Co., Ltd, founded in 1992 and headquartered in Ningbo, China, is a premier manufacturer and distributor of semiconductor packaging materials in the country. With a focus on innovation and quality, the company engages in the production and sale of a wide range of critical components used in the semiconductor industry. Through its subsidiaries, Ningbo Kangqiang Electronics Co., Ltd extends its market reach, ensuring a robust presence in the semiconductor packaging material sector across China.
Products and Services
- Stamping Frameworks
- Etching Frames
- Bonding Wires
- LED Frameworks
- Wire Electrodes
- Precision Mold
- Lead Frames
These are precision-engineered components used to hold and protect semiconductor chips during the packaging process. Stamping frameworks are essential for maintaining the integrity and performance of semiconductor devices.
Etching frames are used in the process of creating intricate patterns on semiconductor materials. They play a crucial role in the fabrication of semiconductor devices by providing precise control over the etching process.
Bonding wires are fine wires used to connect semiconductor devices to their packages. These high-purity wires are critical for establishing electrical connections within semiconductor packages.
Designed specifically for LED devices, these frameworks support the assembly and packaging of light-emitting diodes. LED frameworks enhance the durability and reliability of LED products.
Wire electrodes are used in various semiconductor manufacturing processes, including cutting and welding. They are essential for the precision manufacturing of semiconductor components.
Precision molds are used for casting semiconductor parts with high accuracy. These molds are vital for producing components that meet stringent industry standards.
Lead frames are the metal structures that support semiconductor chips within a package. They facilitate the electrical connections from the chip to the outer pins of the package, playing a crucial role in the functionality of semiconductor devices.
