Fuh Hwa Emerging Markets 10+ Year Bond ETF logo

Fuh Hwa Emerging Markets 10+ Year Bond ETF (00711B)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
15. 84
0
0%
NT$
- Market Cap
0.71% Div Yield
104,987 Volume
NT$ 15.84
Previous Close
Add Transaction
Day Range
15.81 15.84
Year Range
15.21 16.66
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Summary

00711B closed today higher at NT$15.84, an increase of 0% from yesterday's close, completing a monthly decrease of -1.9195% or -NT$0.31. Over the past 12 months, 00711B stock lost -2.7624%.
00711B is not paying dividends to its shareholders.
The stock of the company had never split.
The company's stock is traded on one exchange.

00711B Chart

Fuh Hwa Emerging Markets 10+ Year Bond ETF (00711B) FAQ

What is the stock price today?

The current price is NT$15.84.

On which exchange is it traded?

Fuh Hwa Emerging Markets 10+ Year Bond ETF is listed on TWSE.

What is its stock symbol?

The ticker symbol is 00711B.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.71%.

What is its market cap?

As of today, no market cap data is available.

Has Fuh Hwa Emerging Markets 10+ Year Bond ETF ever had a stock split?

No, there has never been a stock split.

Fuh Hwa Emerging Markets 10+ Year Bond ETF Profile

TWSE Exchange
JP Country

Overview

Tokyo Electron Limited is a pivotal player in the development, manufacturing, and sale of semiconductor and flat panel display (FPD) production equipment. With a footprint that spans Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and other international markets, the company positions itself as a global leader. Integrated within its operations are various subsidiaries that contribute to its expansive product portfolio and technical innovations. Tokyo Electron Limited, since its inception in 1951, and with its headquarters in Tokyo, Japan, has cultivated a reputation for excellence in the semiconductor and FPD production equipment arena.

Products and Services

  • Coaters/Developers: Equipments designed for applying and developing material layers on semiconductor wafers.
  • Etch Systems: Systems used to selectively remove material from the surface of a wafer to create semiconductor devices.
  • Surface Preparation Systems: Technologies used for the cleaning and preparation of semiconductor wafer surfaces prior to processing.
  • Deposition Systems: Equipment employed for depositing various types of materials onto wafers.
  • Test Systems: Devices designed for testing the electrical properties of semiconductors during the manufacturing process.
  • Wafer Bonders/Debonders: Machines used for bonding wafers together and then separating them after processes are completed.
  • Wafer Edge Trimming: Equipment tailored for trimming the edge of semiconductor wafers to prepare them for further processing.
  • SiC Epitaxial CVD Systems: Specialized systems for depositing silicon carbide (SiC) on semiconductor devices, benefiting high-power applications.
  • Gas Cluster Ion Beam System: A system used for surface modification, including etching and deposition processes, using cluster ion beams.
  • Cleaning Systems: Technologies focused on the removal of contaminants from semiconductor wafers to ensure quality and reliability.
  • Plasma Etch/Ash Systems: Critical in the manufacturing of flat panel displays (FPDs), these systems are used for etching materials or removing photoresist through plasma technology.
  • Inkjet Printing Systems for OLED Displays: Advanced printing systems designed specifically for the production of OLED displays using inkjet technology.
  • Delivery, Facility Management, and Non-Life Insurance Services: Supplementary services to support the core manufacturing processes, including material delivery, facility management, and insurance coverage.
  • Sale of Semiconductor Products, Board Computer Products, Software, and Other Electronic Components: Distribution of a wide range of semiconductor-related products, highlighting the company's diverse offerings.
  • Network/Storage/Middleware Related Solutions: Providing sales and support for solutions that enhance network storage and middleware capabilities.
  • Magnetic Annealing Systems: Devices developed for the process of magnetically annealing semiconductors to improve their magnetic properties.

Contact Information

Address: Akasaka Biz Tower
Phone: 81 3 5561 7000