Daeduck Electronics Co., Ltd. Preferred Stock (00806K)
KRX SM KRX SM Primary Summary
Daeduck Electronics Co., Ltd. Preferred Stock (00806K) FAQ
What is the stock price today?
On which exchange is it traded?
What is its stock symbol?
Does it pay dividends? What is the current yield?
What is its market cap?
Has Daeduck Electronics Co., Ltd. Preferred Stock ever had a stock split?
Daeduck Electronics Co., Ltd. Preferred Stock Profile
| Electronic Equipment, Instruments & Components Industry | Information Technology Sector | Mr. Young-Jae Kim CEO | KRX SM Exchange | KR700806K010 ISIN |
| KR Country | 12 Employees | 30 Mar 2026 Last Dividend | 28 Apr 2020 Last Split | - IPO Date |
Overview
Daeduck Co.,Ltd. is an established entity in the realm of electronics, focusing on the manufacturing and sales of printed circuit boards (PCBs) within South Korea. Since its inception in 1972, Daeduck Co.,Ltd. has carved a niche for itself through its dedication to innovation and quality, establishing a stronghold in the industry. With its headquarters nestled in Ansan-Si, South Korea, the company has grown to serve a pivotal role in the PCB industry, catering to a wide range of needs in semiconductor packaging and network communications, including the advanced realms of 5G technology.
Products and Services
- Flip Chip Ball Grid Array (FCBGA)
Daeduck Co.,Ltd. produces FCBGA PCBs tailored for semiconductor packaging, optimizing the connection and performance of integrated circuits. This technology enables higher levels of functionality and miniaturization in electronics.
- Flip Chip Chip Scale Package (FCCSP)
The FCCSP offerings by Daeduck enable devices to perform with greater efficiency by reducing the space required for chip connections. This is instrumental in achieving compact and streamlined designs in electronic products.
- Chip Scale Package (CSP)
These PCBs are designed to closely approximate the size of the semiconductor die, further pushing the limits of miniaturization in electronics. CSPs are vital for modern, high-performance devices requiring minimal space and weight.
- System in Package (SiP)
Daeduck's SiP solutions integrate multiple electronic components into a single package. This approach allows for significant advancements in functionality while maintaining or reducing the overall footprint of the device.
- Antenna in Package (AiP)
This innovative offering incorporates antenna functionality directly within the package of the semiconductor. AiP is a cornerstone technology for enabling efficient and compact wireless communication in a wide array of devices, especially critical for 5G technology.
- Flip Chip Board on Chip (FCBOC)
FCBOC technology represents a method of mounting the flip chip on a circuit board, which is then used as a chip itself. This technology is pivotal for enhancing the performance of semiconductor packages and achieving higher efficiency in electronic devices.
- PCBs for Networks
Daeduck Co., Ltd. is at the forefront of developing PCBs that cater to network infrastructure, including wired networks and optical modules. The company is also a significant contributor to 5G communications technology, producing PCBs that meet the demanding requirements of next-generation networks.
