HLB Innovation Co., Ltd. (024850)
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HLB Innovation Co., Ltd. Profile
| Semiconductors & Semiconductor Equipment Industry | Information Technology Sector | - CEO | KRX SM Exchange | - ISIN |
| South Korea Country | 62 Employees | - Last Dividend | 4 May 2026 Last Split | - IPO Date |
Overview
HLB innoVation Co., Ltd., formerly known as PSMC Co., Ltd., is a prestigious entity in the realm of electronic components and dies, priding itself on a heritage that dates back to 1978. With a strategic headquarters in Hwaseong-si, South Korea, the company has cultivated a robust international presence, catering to a diverse clientele across the globe. HLB innoVation is lauded for its advanced manufacturing capabilities and a broad spectrum of high-quality products, touching upon various sectors such as automotive, medical devices, and optoelectronics. Embracing innovation at its core, the company has successfully navigated the dynamic tech landscape, adapting to changing market demands and technological advances, thereby solidifying its stature as a leading manufacturer and supplier in the electronics industry.
Products and Services
- Lead Frames:
HLB innoVation offers a comprehensive array of lead frames designed for a multitude of applications. The portfolio includes Plastic Dual In-line Package (PDIP), Plastic Leaded Chip Carrier (PLCC), Small Outline Integrated Circuit (SOIC), Quad Flat Pack (QFP), and Transistor Outline among others. These lead frames are vital in semiconductor packaging, meeting the extensive demands of the industry for reliability and performance.
- Tooling Products:
The company's expertise extends to the production of high-precision tooling products. This range encompasses lead frame tool, mold tool, and contact mold, essential in the creation and assembly of electronic components. Each tool is crafted to ensure accuracy, longevity, and efficiency in the manufacturing process.
- Pre-mold Products:
HLB innoVation's pre-mold products find their application in critical and sensitive sectors like automotive sensors, medical devices, and optoelectronics. These products are tailored for image and pressure sensors, offering packaging solutions that align with the stringent quality and reliability standards of their respective industries.
- Semiconductor Product Solutions:
The company also specializes in providing riveted Lead Frames (L/F) for high-heat producing semiconductor products, lead frames for power modules, and Land Grid Array (LGA), Ball Grid Array (BGA), and Thin Small Outline Package (TSOP) products. These are crucial for various applications including CPUs, institutional electronics, PCs, laptops, small portable laptops, smartphones, etc., showcasing HLB innoVation’s commitment to supporting the technological backbone of today's digital society.
