Leform Bhd logo

Leform Bhd (0266)

Market Closed
11 Aug, 07:45
XKLS XKLS
RM
0. 17
+0.01
+6.0606%
RM
- Market Cap
- P/E Ratio
0.1% Div Yield
3.25M Volume
- Eps
RM 0.17
Previous Close
Add Transaction
Day Range
0.17 0.17
Year Range
0.14 0.18
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Name Ex-Dividend Date Dividend Payment Date Record Date Declaration Date Frequency
Tian Teck Land Limited logo
0266 Announced
Tian Teck Land Limited
Pay in 2 months
15 Sep 2026
HKD0.08
20 Oct 2026
17 Sep 2026
-
Semi Annual
Tian Teck Land Limited logo
0266 Paid
Tian Teck Land Limited
19 Jan 2026
12 Dec 2025
HKD0.05
19 Jan 2026
15 Dec 2025
-
Quarterly
Tian Teck Land Limited logo
0266 Paid
Tian Teck Land Limited
17 Oct 2025
16 Sep 2025
HKD0.08
17 Oct 2025
17 Sep 2025
-
Other

0266 Dividend FAQ

What is the dividend yield?

The current dividend yield for 0266 is 0.1%, based on the most recent dividend payment and the current stock price of RM0.17 on the XKLS.

How often are dividends paid?

Dividends are paid on a quarterly basis, with typical payment being march, june, september, december.

When is the next dividend payment date?

The next dividend payment is expected to be on 2026-09-15, Use our Dividend Tracker to monitor 0266 payment history and future distributions.

What is the dividend history?

The company has a dividend payment history that includes 0 years of consistent payments. The most recent payment was RM0.05 per share on 2025-12-12. For related earnings insights, visit the 0266 Earnings page.

What is the average annual dividend growth rate?

There is no dividend growth rate for 0266, as Leform Bhd has not paid dividends in the past.

How can I track 0266 dividends?

You can easily track 0266 dividend payments using our Dividend Tracker. It helps you monitor upcoming payment dates, yields, history, and more - all in one place.