Hanmi Semiconductor Co., Ltd. (042700)

Overview

HANMI Semiconductor Co., Ltd., established in 1980, stands as a pioneering force in the semiconductor equipment manufacturing industry, both within its home territory of South Korea and on an international scale. The company has dedicated itself to the innovation and production of high-caliber semiconductor equipment, catering to a diverse array of requirements in the semiconductor manufacturing process. By embracing technological advancements and maintaining a strong focus on research and development, HANMI Semiconductor has carved out a significant position within the competitive landscape of semiconductor equipment suppliers. Based in Incheon, South Korea, the company's commitment to excellence and quality has enabled it to build a robust global presence, reflecting its status as a key player in the semiconductor industry.

Products and Services

• Vision Placement Equipment: Advanced machinery designed for the precise placement of semiconductor components, facilitating highly accurate assembly processes.
• Flip Chip and Die Bonders: Equipment tailored for various bonding techniques, including TSV dual stacking and flip chip bonding, essential for modern semiconductor device fabrication.
• EMI Shield Attachment and Removal Equipment: Solutions for the application and removal of EMI shields to protect semiconductor devices from electromagnetic interference, including vision attach and detach systems, tape mounters, and laser cutting devices.
• Vision Inspection Equipment: Systems developed for the thorough inspection of semiconductor devices, ensuring quality and consistency in production.
• Molding Equipment: A range of mold press equipment, including auto mold, compression auto mold, mechanical, and hydraulic presses, for the encapsulation of semiconductor devices.
• Laser Processing Equipment: High-precision laser marking, wafer marking, ablation, and cutting equipment used for detailed processing and identification of semiconductor materials.
• Trim and Form/Singulation Devices: Equipment for the precise trimming, forming, and singulation of semiconductor components, enabling efficient preparation for packaging.
• Test Handlers and Related Equipment: Comprehensive testing solutions, including handlers and vision placement systems, for evaluating the performance and reliability of semiconductor devices.
• Automation and Pick and Place Systems: Automated systems for the efficient handling, placement, and sorting of semiconductor components, enhancing productivity and precision in the manufacturing process.