Lb Semicon Inc. (061970)

Overview

LB Semicon Inc., established in 2000 and headquartered in Pyeongtaek, South Korea, is an innovative provider of semiconductor technology solutions, specializing in wafer fabrication and packaging services. The company has established itself as a leader in the field by leveraging advanced flip-chip wafer bumping technologies and offering a comprehensive suite of wafer-level packaging and testing solutions. LB Semicon Inc. is committed to delivering high-quality products and services that meet the evolving needs of the semiconductor industry, focusing on efficiency, reliability, and cutting-edge technology implementation.

Products and Services

• Flip-Chip Wafer Bumping Technology: LB Semicon Inc. excels in flip-chip wafer bumping, a process critical for connecting the semiconductor die to external circuits. This technology enables more compact and reliable electronic devices.
• Wafer-Level Packaging: The company provides wafer-level packaging (WLP) solutions, facilitating the integration and packaging of integrated circuits (ICs) directly at the wafer level, improving performance and reducing costs.
• Gold Bumped Wafers: Offering gold bumped wafers compatible with various packaging formats, including tape carrier packages (TCP), chip on glass (COG), and chip on films (COF), LB Semicon enhances the electrical connection quality in semiconductor devices.
• Solder Bumps: LB Semicon's solder bump services cater to a range of flip-chip packaging applications, serving as a crucial link between the chip and external circuitry.
• Copper Pillar Bumps: Specializing in Cu pillar bumping, a technology essential for fine-pitch applications, enabling higher performance and smaller form factor semiconductor devices.
• Gold Redistribution Layer (RDL): The company's gold RDL service is designed for repositioning the I/O pad layout, which is integral in achieving optimized connectivity and functionality in semiconductor devices.
• Thick Copper (Cu) Products: LB Semicon provides thick Cu products for applications requiring enhanced power distribution and thermal management within semiconductor packages.
• Wafer Test Solutions: Offering comprehensive wafer test solutions, including O/S and function checks, LB Semicon ensures the reliability and performance of semiconductor devices before they proceed to final packaging.
• Back-End Services: The company's back-end services encompass back grinding, laser marking, dicing saw, and visual inspection, essential steps for preparing semiconductor wafers for final assembly and shipping. Additionally, LB Semicon offers drop ship services for direct delivery to designated locations.