Enter Air S.A. logo

Enter Air S.A. (10N)

Market Open
9 Jun, 07:32
XDUS XDUS
12. 30
+0.2
+1.6529%
- Market Cap
- P/E Ratio
0.71% Div Yield
0 Volume
- Eps
12.1
Previous Close
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Day Range
12.12 12.3
Year Range
11.22 15.68
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Summary

10N trading today higher at €12.3, an increase of 1.6529% from yesterday's close, completing a monthly decrease of -0.1623% or -€0.02. Over the past 12 months, 10N stock lost -10.9986%.
10N is not paying dividends to its shareholders.
The stock of the company had never split.
The company's stock is traded on 4 different exchanges and in various currencies, with the primary listing on XFRA (EUR).

10N Chart

Enter Air S.A. (10N) FAQ

What is the stock price today?

The current price is €12.30.

On which exchange is it traded?

Enter Air S.A. is listed on XDUS.

What is its stock symbol?

The ticker symbol is 10N.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.71%.

What is its market cap?

As of today, no market cap data is available.

Has Enter Air S.A. ever had a stock split?

No, there has never been a stock split.

Enter Air S.A. Profile

Passenger Airlines Industry
Industrials Sector
Tony Kawai CEO
XDUS Exchange
PLENTER00017 ISIN
JP Country
17,702 Employees
30 Jun 2025 Last Dividend
- Last Split
- IPO Date

Overview

Tokyo Electron Limited is a pivotal player in the development, manufacturing, and sale of semiconductor and flat panel display (FPD) production equipment. With a footprint that spans Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and other international markets, the company positions itself as a global leader. Integrated within its operations are various subsidiaries that contribute to its expansive product portfolio and technical innovations. Tokyo Electron Limited, since its inception in 1951, and with its headquarters in Tokyo, Japan, has cultivated a reputation for excellence in the semiconductor and FPD production equipment arena.

Products and Services

  • Coaters/Developers: Equipments designed for applying and developing material layers on semiconductor wafers.
  • Etch Systems: Systems used to selectively remove material from the surface of a wafer to create semiconductor devices.
  • Surface Preparation Systems: Technologies used for the cleaning and preparation of semiconductor wafer surfaces prior to processing.
  • Deposition Systems: Equipment employed for depositing various types of materials onto wafers.
  • Test Systems: Devices designed for testing the electrical properties of semiconductors during the manufacturing process.
  • Wafer Bonders/Debonders: Machines used for bonding wafers together and then separating them after processes are completed.
  • Wafer Edge Trimming: Equipment tailored for trimming the edge of semiconductor wafers to prepare them for further processing.
  • SiC Epitaxial CVD Systems: Specialized systems for depositing silicon carbide (SiC) on semiconductor devices, benefiting high-power applications.
  • Gas Cluster Ion Beam System: A system used for surface modification, including etching and deposition processes, using cluster ion beams.
  • Cleaning Systems: Technologies focused on the removal of contaminants from semiconductor wafers to ensure quality and reliability.
  • Plasma Etch/Ash Systems: Critical in the manufacturing of flat panel displays (FPDs), these systems are used for etching materials or removing photoresist through plasma technology.
  • Inkjet Printing Systems for OLED Displays: Advanced printing systems designed specifically for the production of OLED displays using inkjet technology.
  • Delivery, Facility Management, and Non-Life Insurance Services: Supplementary services to support the core manufacturing processes, including material delivery, facility management, and insurance coverage.
  • Sale of Semiconductor Products, Board Computer Products, Software, and Other Electronic Components: Distribution of a wide range of semiconductor-related products, highlighting the company's diverse offerings.
  • Network/Storage/Middleware Related Solutions: Providing sales and support for solutions that enhance network storage and middleware capabilities.
  • Magnetic Annealing Systems: Devices developed for the process of magnetically annealing semiconductors to improve their magnetic properties.

Contact Information

Address: Akasaka Biz Tower
Phone: 81 3 5561 7000