Kinik Company (1560)

Overview

Founded in 1953 and headquartered in New Taipei City, Taiwan, Kinik Company specializes in the production and sales of a wide range of abrasives, cutting tools, and reclaimed wafers. The company operates both locally and internationally, catering to the needs of various industries with its comprehensive lineup of products. Through years of innovation and service, Kinik has established itself as a leading name in the manufacturing of precision tools and materials for the machining and semiconductor industries.

Products and Services

• Conventional Grinding Wheels: These are designed for a variety of grinding operations, providing high material removal rates and excellent surface finishes on metals and other materials.
• Diamond/CBN Grinding Wheels: Offered for grinding hard materials such as steel, hard metal alloys, and ceramics, these wheels feature diamonds or cubic boron nitride as the abrasive material for superior performance.
• DLC Coatings: Kinik provides Diamond-Like Carbon (DLC) coatings that enhance the wear resistance and reduce the friction of tools and components, extending their life span in demanding environments.
• Reclaimed Wafers: The company also specializes in the reclaiming of wafers, providing a cost-effective and environmentally friendly solution for semiconductor manufacturing by recycling and refurbishing used silicon wafers.
• Porous Ceramic Chuck Tables: These are utilized in semiconductor manufacturing for holding and transporting wafers. Their porous nature allows for uniform vacuum distribution, ensuring stability during processing.
• CMP Diamond Disks: Designed for Chemical Mechanical Planarization (CMP), these disks are used in semiconductor fabrication to create flat, ultra-smooth surfaces on silicon wafers.
• Ultra Precision Machining Tools: These tools are made for tasks requiring extreme precision, catering to industries that produce optical components, precision machinery parts, and other high-precision products.
• Dicing Blades: Kinik produces blades used in the dicing of silicon wafers, ensuring high precision cuts with minimal chip and damage, suitable for semiconductor production.
• Diamond Rollers: These are used in the production of textured or patterned surfaces on materials like steel and aluminum, offering precision and efficiency in such applications.
• Wafer Grinding Wheels: Specifically designed for the thinning and fine grinding of silicon wafers, these wheels contribute to the efficiency and cost-effectiveness of semiconductor manufacturing processes.
• Diamond and CBN Honey Comb Wheels: These specialized wheels offer unique grinding solutions for materials that are difficult to machine, providing high precision and minimal surface damage.
• Anti-slip Type Vacuum Chucks: Kinik offers vacuum chucks that feature anti-slip surfaces, enhancing the stability and accuracy of workpieces during machining processes.