| Machinery Industry | Industrials Sector | - CEO | TWSE Exchange | TW0001595007 ISIN |
| Taiwan Country | - Employees | 10 Jul 2025 Last Dividend | 2 Oct 2017 Last Split | - IPO Date |
Chime Ball Technology Co., Ltd., founded in 1999 and headquartered in Taoyuan City, Taiwan, stands as a prominent entity in the realm of photolithography equipment manufacturing, particularly within the Printed Circuit Board (PCB) industry. Dedicated to innovation, the company excels in the research, development, production, and marketing of CCD semi-automatic exposure machines. Over the years, it has expanded its product line to include advanced green LED and mercury lamp source exposure units tailored for various applications such as inner layers, outer layers, and solder mask development. Additionally, Chime Ball Technology offers a selection of direct imaging systems. These offerings are complemented by an array of related equipment, including automatic lamination units, exposure lamps, UV energy illuminometers, and touch panel exposure machines. This holistic approach to product development allows Chime Ball Technology to cater to a wide range of needs within the electronics manufacturing sector, emphasizing efficiency, precision, and sustainability. The company's commitment to quality and innovation has positioned it as a key player in Taiwan's competitive technology landscape.
These machines are the cornerstone of Chime Ball Technology's offerings, designed for precision exposure in the PCB manufacturing process. Utilizing advanced CCD technology, these units ensure accurate alignment and exposure, essential for the intricate patterning required in modern PCB design.
Chime Ball offers a range of exposure units powered by both green LED and mercury lamp sources. These units accommodate different stages of PCB development, including inner layer exposure, outer layer exposure, and solder mask application. LED units are highlighted for their energy efficiency and longer lifespan, while mercury lamps are valued for their intensity and depth of cure.
To meet the demands for higher precision and faster throughput in PCB manufacturing, Chime Ball provides direct imaging (DI) systems. DI technology enables pattern transfer directly onto the resist-coated panels without the need for physical masks, dramatically improving alignment accuracy and reducing production times.
A key part of the prepreg (pre-impregnated composite fibers) lamination process in PCB production, these units facilitate the automatic lamination of multi-layer boards. They ensure uniform application of pressure and heat, critical for the integrity and reliability of the final product.
A complement to the company’s main exposure units, these lamps are designed for specific applications within the exposure process. They are engineered to meet the precise requirements of different stages of PCB production, offering reliability and performance.
This equipment is essential for monitoring UV exposure levels across various manufacturing processes. Ensuring the consistency and adequacy of UV exposure is crucial for process reliability and product quality in PCB and other photolithography applications.
Incorporating touch panel interfaces with exposure machines enhances user interaction and control, allowing for more efficient operation and process tuning. This integration signifies Chime Ball’s commitment to adopting advancements in user interface technology to improve usability and productivity.