Advanced Process Systems Corporation (265520)

Overview

Advanced Process Systems Corporation, initially founded as Kornic Systems Corporation in 1994, has developed into a key player in the semiconductors and display manufacturing equipment market. Its operations primarily span across South Korea, China, and Vietnam, focusing on the development and sales of various high-tech manufacturing systems. In 2009, the company underwent a significant transformation, rebranding itself from Kornic Systems Corporation to Advanced Process Systems Corporation, marking a new era in its commitment to advanced manufacturing solutions. Based in Hwaseong-si, South Korea, Advanced Process Systems Corporation has established a significant footprint in the industry, driven by innovation and excellence.

Products and Services

Advanced Process Systems Corporation offers a diverse range of products and services tailored for the semiconductors and display manufacturing industries, including:

• Excimer Laser Annealing Equipment: Utilized in the production of high-quality semiconductors, this equipment uses a high-intensity UV laser to alter the properties of semiconductor materials, enhancing their performance.
• Laser Lift-Off Equipment: This technology is essential for separating thin film layers from their substrates without damage, a crucial step in the manufacturing of OLED displays and semiconductors.
• Fine Metal Micro-Machining Equipment: Designed for the precise machining of metal components, this equipment is vital for creating intricate parts used in various high-tech applications.
• Glass Laser Scribing In-Line Equipment: This system is employed for the high-precision scribing of glass substrates, an essential process in the production of flat panel displays.
• Film Laser Cutting Equipment: Offers precision in cutting film materials, key for producing components in consumer electronics like smartphones and tablets.
• Rapid Thermal Processing Equipment: A process that rapidly heats semiconductor wafers to high temperatures, enabling dopant activation or the annealing of deposited materials on the wafer surface.
• One Drop Filling and Encapsulation Systems: Critical for OLED display production, this technology precisely dispenses a single droplet of material, followed by encapsulation to protect against environmental factors.
• Temporary Bond and De-bond Process Systems: These systems facilitate the temporary adhesion of wafers to carriers for processing, followed by a safe detachment post-process, essential for thin wafer handling.
• Thin Film Encapsulation and Sputter Systems: Utilized to create barrier layers that protect sensitive OLED materials from moisture and oxygen.
• Dry Strip and Descum Systems: These systems are used for the removal of photoresist (a light-sensitive material) and other residues from wafers after patterning, a crucial step in semiconductor fabrication.