Shin Shin Co., Ltd. logo

Shin Shin Co., Ltd. (2901)

Market Closed
15 Jun, 05:30
TWSE TWSE
NT$
23. 70
+0.1
+0.4237%
NT$
1.8B Market Cap
65.55 P/E Ratio
- Div Yield
21,211 Volume
1.59 Eps
NT$ 23.6
Previous Close
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Day Range
23.4 24.1
Year Range
22.45 28.05
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Summary

2901 closed today higher at NT$23.7, an increase of 0.4237% from yesterday's close, completing a monthly increase of 1.7167% or NT$0.4. Over the past 12 months, 2901 stock lost -4.2424%.
2901 pays dividends to its shareholders, with the most recent payment made on Sep 22, 2025. The next estimated payment will be in In 3 months on Sep 22, 2026 for a total of NT$0.37106.
The last earnings report, released on Jun 26, 2025, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0.0165%, based on the last three reports.
Shin Shin Co., Ltd. has completed 1 stock splits, with the recent split occurring on Oct 13, 2000.
The company's stock is traded on one exchange.

2901 Chart

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Shin Shin Co., Ltd. (2901) FAQ

What is the stock price today?

The current price is NT$23.70.

On which exchange is it traded?

Shin Shin Co., Ltd. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 2901.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, the market cap is 1.8B.

Has Shin Shin Co., Ltd. ever had a stock split?

Shin Shin Co., Ltd. had 1 splits and the recent split was on Oct 13, 2000.

Shin Shin Co., Ltd. Profile

Automobile Components Industry
Consumer Discretionary Sector
Tang Liu CEO
TWSE Exchange
TW0002901006 ISIN
TW Country
33 Employees
23 Aug 2022 Last Dividend
13 Oct 2000 Last Split
1 Nov 2004 IPO Date

Overview

Kinsus Interconnect Technology Corp., established in 2000 and headquartered in Taoyuan City, Taiwan, operates globally, specializing in the manufacture and sale of electronic products. The company serves a wide range of sectors, including handset and wearable devices, microprocessors, and medical equipment fields, through its robust portfolio of subsidiaries. Kinsus Interconnect Technology Corp. stands as a leading provider in electronic components, leveraging its expertise in research and development to offer innovative solutions to manufacturers of electronic products worldwide.

Products and Services

  • System in Package (SiP): This product serves as a carrier substrate facilitating the assembly of multiple chips, packages, or passive components. Primarily used in modules for handset and wearable devices, it underscores the company's capability in integrating complex systems into compact spaces.
  • Plastic Ball Grid Array (PBGA) Substrate: Designed for microprocessors, controllers, graphic processors, ASIC, and PC chipsets, this substrate exemplifies Kinsus Interconnect Technology's commitment to supporting high-performance computing components.
  • Flip Chip Chip Scale Package (FCCSP) Substrate: Aimed at application processors and connectivity applications, this substrate underscores the company’s focus on facilitating faster and more efficient data processing and transmission.
  • Wire Bond Chip Scale Package (WBCSP) Substrate: This product finds its application in processors, connectivity, power management, and memory modules, showcasing the versatility of Kinsus Interconnect Technology's offerings.
  • Radio Frequency (RF) Modules Substrate: Specialized for power amplifier, front end modules, and Wi-Fi connectivity modules applications, it reflects the company’s contribution to enhancing wireless communication capabilities.
  • Flip Chip Ball Grid Array (FCBGA) Substrate: Used in micro and graphic processors, ASIC, and field programmable gate arrays, this substrate demonstrates Kinsus Interconnect Technology Corp.'s support for advanced processing needs.
  • Additional Offerings: Beyond electronic components, the company diversifies its portfolio through the manufacture and sale of medical equipment and cosmetic products. It also engages in the wholesale and retail of electronic materials, providing consultation services for business operation and management, and engages in investment and trading activities. Furthermore, Kinsus produces, manufactures, and sells contact lenses, illustrating its broad scope in manufacturing and service provision.

Contact Information

Address: No. 247, Linsen North Road, Taipei, Taiwan, 10447
Phone: 886 2 2521 2211