Broadex Technologies Co., Ltd. (300548)

Overview

Broadex Technologies Co., Ltd. is a leading enterprise in the development, production, and sales of integrated optoelectronic devices, primarily serving the optical communications sector both within China and on the international stage. Founded in the year 2003, and with its base of operations located in Jiaxing, China, Broadex Technologies has carved a niche for itself by presenting innovative solutions that cater to telecommunications, data communications, the consumer industrial Internet, and the broader optical communication industry. Through its commitment to research and technological advancement, Broadex Technologies has positioned itself as a pivotal player in its field.

Products and Services

• PLC, Thermal and Athermal AWG Modules: These devices are essential for wavelength division multiplexing applications, enhancing the efficiency and capacity of optical communication networks by combining or splitting light signals.
• VMUX: A device designed to multiplex various optical signals, increasing bandwidth and improving the management of dense wavelength division multiplexing (DWDM) systems.
• MEMS VOA: Micro-Electro-Mechanical Systems Variable Optical Attenuators used for managing signal strength in optical fibers, providing precise control over the intensity of light passing through an optical network.
• Optical Splitters: Essential components for distributing optical signals across multiple paths, integral to the branching of optical networks in applications such as fiber to the home (FTTH).
• Fiber Arrays: Assemblies that organize multiple optical fibers in a specific geometric pattern, crucial for the interfacing of optical fibers with optoelectronic devices.
• High Speed Cables: Cables designed to support high-speed data transmission, crucial for the backbone of contemporary high-demand data transmission applications.
• Silica-on-Silicon PLC: This technology overlays silica optical circuits on silicon wafers, facilitating the miniaturization and integration of optical components for more compact and efficient devices.
• Transceiver Packaging: Providing secure and reliable casing solutions for optical transceivers, ensuring the longevity and performance of these critical communication devices.
• Silicon Photonics: The integration of photonic systems using silicon as a platform, offering significant advantages in terms of performance, scalability, and integration with electronic components.
• Design Manufacturing Services for PLC Chip and Fiber Array: Customized design and manufacturing solutions for planar lightwave circuit chips and fiber arrays, catering to specific requirements of customers in the optical communication industry.
• Silicon Photonics Packaging, MEMS and Hermetic Package Design, Free Space Assembly, and AR Coating Services: A suite of services aimed at packaging and finishing, including the design of micro-electromechanical systems and hermetic packages, as well as assembly services and anti-reflective coating applications to enhance the performance of optical components.