Shenzhen Fine Made Electronics Group Co., Ltd. logo

Shenzhen Fine Made Electronics Group Co., Ltd. (300671)

Market Closed
11 Aug, 06:57
XSHE XSHE
¥
62. 22
-0.6
-0.9551%
¥
7.6B Market Cap
- P/E Ratio
1.19% Div Yield
11.18M Volume
- Eps
¥ 62.82
Previous Close
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Day Range
61.16 63.88
Year Range
31.26 105.58
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Summary

300671 closed today lower at ¥62.22, a decrease of -0.9551% from yesterday's close, completing a monthly decrease of -29.5995% or -¥26.16. Over the past 12 months, 300671 stock gained 93.41%.
300671 is not paying dividends to its shareholders.
The last earnings report, released on May 15, 2025, exceeded the consensus estimates by 0%. On average, the company has fell short of earnings expectations by -0.0692%, based on the last three reports.
Shenzhen Fine Made Electronics Group Co., Ltd. has completed 2 stock splits, with the recent split occurring on May 27, 2021.
The company's stock is traded on one exchange.

300671 Chart

Shenzhen Fine Made Electronics Group Co., Ltd. (300671) FAQ

What is the stock price today?

The current price is ¥62.22.

On which exchange is it traded?

Shenzhen Fine Made Electronics Group Co., Ltd. is listed on XSHE.

What is its stock symbol?

The ticker symbol is 300671.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 1.19%.

What is its market cap?

As of today, the market cap is 7.6B.

Has Shenzhen Fine Made Electronics Group Co., Ltd. ever had a stock split?

Shenzhen Fine Made Electronics Group Co., Ltd. had 2 splits and the recent split was on May 27, 2021.

Shenzhen Fine Made Electronics Group Co., Ltd. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Mr. Jingyu Liu CEO
XSHE Exchange
CNE100002NR8 ISIN
China Country
791 Employees
31 May 2022 Last Dividend
14 Jun 2018 Last Split
- IPO Date

Overview

Shenzhen Fine Made Electronics Group Co., Ltd. is a prominent player in the semiconductor industry, focusing on the design, development, packaging, testing, and sales of both analog and digital-analog hybrid integrated circuits within China. Founded in 2001 and headquartered in Shenzhen, China, the company has carved a niche for itself by offering a wide array of integrated circuit products. These products find application in a diverse range of sectors including consumer electronics, communication equipment, industrial control, automotive electronics, and several emerging sectors such as the Internet of Things, new energy, wearable devices, artificial intelligence, smart home, intelligent manufacturing, 5G communication, and more. Through its extensive product range and technological prowess, Shenzhen Fine Made Electronics Group Co., Ltd. aims to contribute significantly to the advancement and proliferation of modern electronic fields.

Products and Services

The product portfolio of Shenzhen Fine Made Electronics Group Co., Ltd. encompasses a broad spectrum of chips and integrated circuits tailored for various applications. Each product category represents the company’s commitment to innovation, quality, and meeting the demands of an ever-evolving electronics market.

  • Power Management: This product line focuses on efficient energy management and conservation across a wide range of electronic devices to ensure prolonged battery life and reduced energy consumption.
  • LED Screen Control and Drive: These products are designed to enhance the performance of LED screens through advanced control and drive technologies, enabling clearer display output and energy efficiency.
  • MOSFET: Offering Metal-Oxide-Semiconductor Field-Effect Transistors, the company provides components that are essential in the regulation of electronic signals, powering various electronic devices efficiently.
  • MCU (Microcontroller Units): These compact integrated circuits serve as the brain of an array of consumer and industrial devices, offering control through embedded processors, memory, and peripherals.
  • Fast Charging Protocol: The company has developed protocols that significantly reduce the charging time for electronic devices, enhancing convenience for users.
  • RFID (Radio-Frequency Identification): This technology enables wireless data transmission for identification and tracking purposes, widely used in security, logistics, and inventory management.
  • Radio Frequency Front-End and Module Chips: These products play a critical role in wireless communication devices, enhancing signal transmission and reception quality.
  • Various ASIC Chips (Application-Specific Integrated Circuits): Designed for specific applications rather than general-purpose use, these chips are tailored to meet the unique needs of customers, providing optimized performance and functionality.

Contact Information

Address: 37th Floor, Building B
Phone: 86 75 5834 92887