Psk Inc. (319660)

Overview

PSK Inc., founded in 1990 and based in Hwaseong-si, South Korea, is a prominent player in the semiconductor processing equipment industry with a global presence. The company specializes in developing, manufacturing, and selling a wide variety of equipment critical for the production of semiconductors. Its offerings encompass a range of processes including dry stripping, dry cleaning, hard mask stripping, edge cleaning, and 3D IC packaging, catering to the diverse needs of the semiconductor manufacturing sector.

Products and Services

• Dry Strip Products: PSK Inc. offers advanced solutions for dry stripping, a process essential for removing photoresist and other materials from the semiconductor wafer without using liquid chemicals. This method is crucial for ensuring the purity and performance of semiconductor devices.
• Dry Cleaning Products: The company's dry cleaning equipment is designed to clean semiconductor wafers without the need for water or other liquid solvents. This technology helps in minimizing contamination and is integral to the production of high-quality semiconductor devices.
• New Hard Mask Strip Products: PSK Inc.'s hard mask stripping equipment is tailored for the efficient and precise removal of hard masks used in the lithography process of semiconductor manufacturing. This is vital for the accurate patterning of semiconductor materials.
• Edge Clean Products: The edge clean systems provided by PSK Inc. are specialized tools for removing residues and contaminants from the edges of semiconductor wafers. This process is crucial for the overall yield and quality of the semiconductor manufacturing process.
• 3D IC Packing Equipment: The company also offers a comprehensive range of equipment for 3D IC packaging, a cutting-edge technology that allows for the stacking and interconnection of semiconductor chips in a three-dimensional configuration. This includes:
  • Plasma Source: Equipment designed to generate plasma for various surface treatments and cleaning processes, enhancing the efficacy of semiconductor manufacturing.
  • Reflow: PSK Inc. provides reflow systems that are essential for ensuring the proper soldering and bonding of semiconductor components during the 3D IC packaging process.
  • Hot DI: Hot Deionized (DI) water systems are used for critical cleaning and preparation of semiconductor wafers, ensuring high levels of purity and preparation for subsequent manufacturing steps.
  • Plasma Surface Treatment Systems: These systems are utilized for modifying the surface properties of semiconductor wafers, crucial for the adhesion of layers and the overall success of the 3D packaging process.