| Electronic Equipment, Instruments & Components Industry | Information Technology Sector | - CEO | KRX SM Exchange | - ISIN |
| South Korea Country | 87 Employees | 28 Dec 2022 Last Dividend | 17 Dec 2021 Last Split | - IPO Date |
RF Materials Co., Ltd., originally established in 2004 as Metal-Life Co., Ltd., transitioned its name in March 2021 to better reflect its evolving business focus. Based in Ansan-si, South Korea, the company has carved a niche in the global market through the development, production, and sales of optical communication packages. Their operations span both domestic and international markets, with a portfolio that supports various high-tech industries such as laser modules, automotive, medical care, X-rays, and aerospace. The renaming signifies the company’s increased emphasis on Radio Frequency (RF) and microwave solutions alongside their existing optical communication and laser module technologies, underscoring their commitment to innovation and technological advancement in these fields.
RF Materials Co., Ltd. offers high-quality packages that cater to the RF and microwave industry. These packages are designed to meet the stringent requirements for performance and reliability in various applications including telecommunications, defense, and aerospace.
The company provides advanced packaging solutions for the optical communication sector. These packages facilitate the efficient transmission of data over optical fibers, supporting the backbone of global internet infrastructure, as well as other applications requiring high-speed data transmission.
RF Materials Co., Ltd. establishes its presence in the laser technology domain through its range of laser modules, including fiber coupled diode lasers, single bar diode lasers, and diode laser bar stacks. These are essential components in a variety of industries such as medical, printing, and material processing.
Utilizing their expertise in High-Temperature Co-fired Ceramic (HTCC) multilayer ceramics technologies, the company manufactures ceramic packages and substrates that offer superior performance in extreme conditions. These are particularly relevant in high temperature and harsh environmental applications.