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Zen Voce Corporation (3581)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
115. 00
+1
+0.8772%
NT$
3.01B Market Cap
- P/E Ratio
2% Div Yield
298,090 Volume
- Eps
NT$ 114
Previous Close
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Day Range
112 118.5
Year Range
33.25 299.5
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Summary

3581 closed today higher at NT$115, an increase of 0.8772% from yesterday's close, completing a monthly decrease of -20.6897% or -NT$30. Over the past 12 months, 3581 stock gained 57.967%.
3581 pays dividends to its shareholders, with the most recent payment made on Aug 07, 2026. The next estimated payment will be in In 11 months on Aug 07, 2027 for a total of NT$0.6.
Zen Voce Corporation has completed 1 stock splits, with the recent split occurring on Nov 06, 2013.
The company's stock is traded on one exchange.

3581 Chart

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Zen Voce Corporation (3581) FAQ

What is the stock price today?

The current price is NT$115.00.

On which exchange is it traded?

Zen Voce Corporation is listed on TWSE.

What is its stock symbol?

The ticker symbol is 3581.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 2%.

What is its market cap?

As of today, the market cap is 3.01B.

Has Zen Voce Corporation ever had a stock split?

Zen Voce Corporation had 1 splits and the recent split was on Nov 06, 2013.

Zen Voce Corporation Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
- CEO
TWSE Exchange
TW0003581005 ISIN
Taiwan Country
- Employees
14 Jul 2026 Last Dividend
6 Nov 2013 Last Split
- IPO Date

Overview

Zen Voce Corporation, originally known as Trutek Cooperation, is a distinguished entity in the semiconductor industry that specializes in manufacturing and selling advanced semiconductor assembly and testing equipment. The company has laid down its roots in Taiwan, stretching its operational reach to serve customers on a global scale. Since its inception in 1999, Zen Voce Corporation has been at the forefront of innovation within the semiconductor, optoelectronic, microelectronics, and LCD equipment sectors. The company’s headquarters are situated in the technological hub of Hsinchu City, Taiwan.

Products and Services

Zen Voce Corporation offers a comprehensive range of products and services catered to the needs of the semiconductor and related industries. Each product line is designed to enhance efficiency, reliability, and performance in the semiconductor manufacturing process.

  • IC Packaging Machines and Bumping Products: These are specialized machines designed for the assembly of integrated circuits (ICs). They facilitate the placement of semiconductor chips into their respective packages. In addition, the company produces bumping products that are essential for creating connections on the chips themselves.
  • Wafer Cutting and Cleaning Machines: These machines are used for slicing silicon wafers from semiconductor ingots and cleaning them to prepare for further processing. They ensure that wafers are cut to precise dimensions and are free of contaminants that could affect the manufacturing process.
  • Board Cutting and Cleaning Machines: Similar to wafer cutting and cleaning machines, these are designed for printed circuit boards (PCBs). They ensure that PCBs are trimmed to exact specifications and cleaned to remove any residues or contaminants.
  • Wafer Test Probe Card PCBs: These are critical for the testing phase in semiconductor manufacturing. Probe cards contain a series of needles used to test the electrical functions of wafers, ensuring that they meet the required standards before proceeding further in the manufacturing process.
  • IC Test HIFIX and CHANG Kits: These kits are designed for the precise and efficient testing of integrated circuits. They include fixtures and tools necessary for securing ICs in place during testing, ensuring accurate and reliable results.
  • SOCKET IC Test Products: These products are used for testing individual ICs. They allow for the temporary mounting of semiconductor devices so that their functionality can be tested without soldering them onto a circuit board.
  • IC Handlers: IC handlers automate the process of placing ICs into test sockets or onto packing materials. They are essential for speeding up the testing and packaging processes in semiconductor manufacturing.
  • SOCKET IC Burn-in Test Products: These are used for stress testing ICs at elevated temperatures to ensure long-term reliability. Burn-in testing helps identify and eliminate potential failures before the ICs are assembled into final products.

Contact Information

Address: No. 53, Jinggong Road
Phone: 886 3 559 9999