Advance Materials Corporation logo

Advance Materials Corporation (3585)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
50. 60
-3.6
-6.6421%
NT$
1.38B Market Cap
- P/E Ratio
- Div Yield
656,074 Volume
- Eps
NT$ 54.2
Previous Close
Add Transaction
Day Range
49.5 54
Year Range
5.48 190
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Summary

3585 closed today lower at NT$50.6, a decrease of -6.6421% from yesterday's close, completing a monthly decrease of -33.9426% or -NT$26. Over the past 12 months, 3585 stock gained 300%.
3585 is not paying dividends to its shareholders.
Advance Materials Corporation has completed 2 stock splits, with the recent split occurring on Nov 15, 2018.
The company's stock is traded on one exchange.

3585 Chart

Advance Materials Corporation (3585) FAQ

What is the stock price today?

The current price is NT$50.60.

On which exchange is it traded?

Advance Materials Corporation is listed on TWSE.

What is its stock symbol?

The ticker symbol is 3585.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, the market cap is 1.38B.

Has Advance Materials Corporation ever had a stock split?

Advance Materials Corporation had 2 splits and the recent split was on Nov 15, 2018.

Advance Materials Corporation Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
- CEO
TWSE Exchange
TW0003585006 ISIN
Taiwan Country
193 Employees
- Last Dividend
15 Nov 2018 Last Split
- IPO Date

Overview

Advance Materials Corporation, established in 1987, is a prominent manufacturer and supplier of electronic materials based in Taoyuan City, Taiwan. The company specializes in developing, producing, and distributing a wide range of products designed for various applications in the electronics industry. With a focus on innovation and quality, Advance Materials Corporation has established itself as a trusted partner for customers worldwide, providing advanced solutions that meet the evolving demands of the technology sector.

Products and Services

  • Copper Clad Laminates: These are essential materials for the manufacture of printed circuit boards (PCBs), providing the base for assembling electronic components.
  • Low CTE Non-flow Prepreg: Pre-impregnated composite fibers with a low coefficient of thermal expansion (CTE) used in multilayer PCBs for enhanced dimensional stability.
  • Mass Lamination Service: Offering large-scale lamination services for electronic components and boards, ensuring uniform quality and efficiency in production.
  • Two-fluid Type Photoimageable Solder Resist: A technology used for applying a solder mask over bare copper traces on PCBs, preventing short circuits and protecting the copper from corrosion.
  • Inner-etching Liquid Photoresist: A sensitive material used in the photolithography process to create precise patterns on substrates for electronic components.
  • Particular Photoresist: Custom photoresist solutions tailored to specific applications and requirements in the manufacturing of semiconductors and PCBs.
  • Flexible Printed Circuit Material: Materials designed for the production of flexible printed circuits (FPCs), which are used in electronic devices requiring flexibility and high performance.
  • Touchscreen Materials: Advanced materials for the manufacture of touchscreens, contributing to the sensitivity and durability of touch-responsive devices.
  • Dry Film Solar Mask: Specialized films used in the production of photovoltaic panels for creating precise patterns during the etching process.
  • Optical Materials: This category includes various products like electrical film, high purity acid/alkali solvents, developer, photoresistor, and release agent, used in applications ranging from display technologies to optical devices manufacturing.

Contact Information

Address: No. 498-2, Nanshan Road
Phone: 886 3 324 6000