Episil Technologies Inc. logo

Episil Technologies Inc. (3707)

Market Closed
10 Aug, 05:30
TWSE TWSE
NT$
62. 30
+2.2
+3.6606%
NT$
17.47B Market Cap
- P/E Ratio
- Div Yield
2.99M Volume
- Eps
NT$ 60.1
Previous Close
Add Transaction
Day Range
60.9 63.4
Year Range
37.05 100.5
Want to track 3707 and more in your Portfolio? 🎯
Sign up for Marketlog, a portfolio tracker that will exceed your expectations!

Summary

3707 closed yesterday higher at NT$62.3, an increase of 3.6606% from Friday's close, completing a monthly decrease of -31.0078% or -NT$28. Over the past 12 months, 3707 stock gained 20.2703%.
3707 is not paying dividends to its shareholders.
The last earnings report, released on May 13, 2026, missed the consensus estimates by -0.14%. On average, the company has fell short of earnings expectations by -0.105%, based on the last three reports.
Episil Technologies Inc. has completed 3 stock splits, with the recent split occurring on Jul 24, 2017.
The company's stock is traded on one exchange.

3707 Chart

People also search for

Tripod Technology Corp.
NT$ 441.5
+9.9626%
Pegatron Corp.
NT$ 89
-0.5587%
Silergy Corp
NT$ 466.5
+0.3226%
Global Unichip Corporation
NT$ 4,955
+9.3819%
Zhen Ding Technology Holding Limited
NT$ 490
+4.1445%

Episil Technologies Inc. (3707) FAQ

What is the stock price today?

The current price is NT$62.30.

On which exchange is it traded?

Episil Technologies Inc. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 3707.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, the market cap is 17.47B.

Has Episil Technologies Inc. ever had a stock split?

Episil Technologies Inc. had 3 splits and the recent split was on Jul 24, 2017.

Episil Technologies Inc. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Mr. Jian-Hua Syu CEO
TWSE Exchange
TW0003707006 ISIN
Taiwan Country
- Employees
- Last Dividend
24 Jul 2017 Last Split
- IPO Date

Overview

Episil Technologies Inc. is a distinguished entity in the semiconductor industry, primarily focused on the research, development, manufacturing, and sales of various silicon epitaxy and epitaxy-related products. Founded in 1985 and initially known as Episil Holding Inc., the company has established a strong presence in the global market, including operations in Taiwan, Japan, China, the United States, and other international locations. With its headquarters situated in Hsinchu City, Taiwan, Episil Technologies stands out as a leading provider of advanced semiconductor materials, contributing significantly to the technological advancements in the sector.

Products and Services

  • Silicon Epitaxy Wafers: These are foundational components used in the manufacture of integrated circuits and other semiconductor devices. Silicon epitaxy wafers offer a pristine crystalline surface upon which additional layers are deposited to build electronic devices.
  • Buried-Layer Epitaxy Wafers: Specifically designed for advanced semiconductor applications, these wafers include buried layers that enhance the performance of electronic devices by improving properties such as speed and power consumption.
  • Multi-Layer Epitaxy Wafers: As the name suggests, these wafers consist of multiple epitaxial layers, each tailored to specific semiconductor applications. These wafers are crucial for creating complex semiconductor devices with enhanced functionality.
  • Silicon Epitaxy on SOI (Silicon on Insulator) Wafers: These wafers are used to fabricate devices with high performance and reduced power consumption. SOI technology isolates the device layer from the bulk silicon, reducing parasitic capacitance and thereby improving speed.
  • GaN (Gallium Nitride) Epitaxy Wafers: GaN wafers are known for their exceptional electronic properties, such as high electron mobility and saturation velocity. This makes them ideal for high-frequency, high-power applications such as RF amplifiers and power electronics.
  • SiC (Silicon Carbide) Epitaxy Wafers: With superior thermal and electrical properties, SiC epitaxy wafers are used in high-power, high-temperature applications. They are particularly relevant in the manufacturing of power electronic devices that operate under extreme conditions.

Contact Information

Address: No.18, Innovation Road I
Phone: 886 3 577 9245