| Software Industry | Information Technology Sector | Mr. Ian Peter Olson AICD, AIMM, B.Com, B.Com., C.A., CA, M.A.I.C.D., M CEO | ASX Exchange | Q7262W109 CUSIP |
| AU Country | - Employees | - Last Dividend | 11 Jul 2016 Last Split | 20 Mar 2008 IPO Date |
Ta Liang Technology Co., Ltd., established in 1969 and based in Taoyuan City, Taiwan, specializes in manufacturing a wide array of equipment catered to the semiconductor and electronic industries. The company's portfolio includes machines for semiconductor inspection, Printed Circuit Board (PCB) routing and drilling, resin panel cutting, Computer Numerical Control (CNC) engraving and milling, as well as glass panel processing. Ta Liang Technology serves a global market, focusing on innovation and precision in equipment to meet the demanding needs of these high-tech sectors.
Designed for multilayer PCB, rigid-flex PCB, and BGA substrate applications, these machines facilitate precise routing operations, critical for modern electronic devices.
Targeted for the manufacturing of touch panel, cover glass, and sensor glass or one glass processing applications. These machines are essential for the production of durable and high-quality display panels.
These machines apply protective coatings on the edges of various materials to enhance durability and performance.
Equipment designed for the automated visual inspection and testing of IC chips, ensuring quality control in semiconductor manufacturing.
Devices that pick and place IC chips for testing and packaging, critical for efficient production processes in the semiconductor industry.
Automated Optical Inspection (AOI) machines for wafer inspection to detect defects at an early stage in the semiconductor manufacturing process.
Systems designed to accurately measure the overlap of chiplets, which is crucial for the performance of multi-die integrated circuits.
Surface Mount Technology (SMT) and Solder Paste Inspection (SPI) Automated Optical Inspection lines for detecting defects in PCB assembly processes.
These machines inspect components on a reel-to-reel basis, ensuring high-speed and efficient quality control for flexible printed circuits and other materials.
Utilizing infrared technology, these machines inspect for defects not visible to the naked eye, critical in ensuring the integrity of electronic components.
Machines designed for the inspection of thermal properties and initial quality checks of materials and components entering the production line.
Automated systems for visual inspection across various stages of manufacturing, enhancing the accuracy and efficiency of quality control.
These systems monitor the condition of Chemical Mechanical Polishing (CMP) pads in situ, ensuring optimal polishing performance during semiconductor wafer processing.
Used to measure the step-heights on semiconductor wafers, these machines are crucial for the verification of layer thickness and uniformity in semiconductor devices.