Pointerra Limited logo

Pointerra Limited (3DP)

Market Closed
ASX ASX
39.45M Market Cap
- P/E Ratio
- Div Yield
239,125 Volume
- Eps
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Summary

3DP is not paying dividends to its shareholders.
The last earnings report, released on Mar 02, 2026, missed the consensus estimates by -0.001%. On average, the company has fell short of earnings expectations by -0.0003%, based on the last three reports.
Pointerra Limited has completed 4 stock splits, with the recent split occurring on Jul 11, 2016.
The company's stock is traded on 3 different exchanges and in various currencies, with the primary listing on ASX (AUD).

Pointerra Limited (3DP) FAQ

On which exchange is it traded?

Pointerra Limited is listed on ASX.

What is its stock symbol?

The ticker symbol is 3DP.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, the market cap is 39.45M.

Has Pointerra Limited ever had a stock split?

Pointerra Limited had 4 splits and the recent split was on Jul 11, 2016.

Pointerra Limited Profile

Software Industry
Information Technology Sector
Mr. Ian Peter Olson AICD, AIMM, B.Com, B.Com., C.A., CA, M.A.I.C.D., M CEO
ASX Exchange
Q7262W109 CUSIP
AU Country
- Employees
- Last Dividend
11 Jul 2016 Last Split
20 Mar 2008 IPO Date

Overview

Ta Liang Technology Co., Ltd., established in 1969 and based in Taoyuan City, Taiwan, specializes in manufacturing a wide array of equipment catered to the semiconductor and electronic industries. The company's portfolio includes machines for semiconductor inspection, Printed Circuit Board (PCB) routing and drilling, resin panel cutting, Computer Numerical Control (CNC) engraving and milling, as well as glass panel processing. Ta Liang Technology serves a global market, focusing on innovation and precision in equipment to meet the demanding needs of these high-tech sectors.

Products and Services

  • PCB Routing Machines:

    Designed for multilayer PCB, rigid-flex PCB, and BGA substrate applications, these machines facilitate precise routing operations, critical for modern electronic devices.

  • Glass Panel Processing Machines:

    Targeted for the manufacturing of touch panel, cover glass, and sensor glass or one glass processing applications. These machines are essential for the production of durable and high-quality display panels.

  • Automatic Edge Coating Machines:

    These machines apply protective coatings on the edges of various materials to enhance durability and performance.

  • IC Chip Test and AVI Handlers:

    Equipment designed for the automated visual inspection and testing of IC chips, ensuring quality control in semiconductor manufacturing.

  • P&P IC Chip Handlers:

    Devices that pick and place IC chips for testing and packaging, critical for efficient production processes in the semiconductor industry.

  • Wafer AOIs:

    Automated Optical Inspection (AOI) machines for wafer inspection to detect defects at an early stage in the semiconductor manufacturing process.

  • Chiplets Overlap Measurement Systems:

    Systems designed to accurately measure the overlap of chiplets, which is crucial for the performance of multi-die integrated circuits.

  • SMT and SPI AOI Lines:

    Surface Mount Technology (SMT) and Solder Paste Inspection (SPI) Automated Optical Inspection lines for detecting defects in PCB assembly processes.

  • Reel-to-Reel AOI Machines:

    These machines inspect components on a reel-to-reel basis, ensuring high-speed and efficient quality control for flexible printed circuits and other materials.

  • IR Vision Inspection Machines:

    Utilizing infrared technology, these machines inspect for defects not visible to the naked eye, critical in ensuring the integrity of electronic components.

  • Thermal Optical and Incoming AOIs:

    Machines designed for the inspection of thermal properties and initial quality checks of materials and components entering the production line.

  • Auto Vision Inspection Machines:

    Automated systems for visual inspection across various stages of manufacturing, enhancing the accuracy and efficiency of quality control.

  • CMP Pad Metrology In-situ Monitor Systems:

    These systems monitor the condition of Chemical Mechanical Polishing (CMP) pads in situ, ensuring optimal polishing performance during semiconductor wafer processing.

  • Step-Height Metrology Machines:

    Used to measure the step-heights on semiconductor wafers, these machines are crucial for the verification of layer thickness and uniformity in semiconductor devices.

Contact Information

Address: 27 Railway Road, Subiaco, WA, Australia, 6008
Phone: 61 8 6323 6100