HPSP Co., Ltd. logo

HPSP Co., Ltd. (403870)

Market Closed
10 Aug, 06:30
KRX SM KRX SM
36,950. 00
+2,550
+7.4128%
2.24T Market Cap
- P/E Ratio
150% Div Yield
2.03M Volume
- Eps
34,400
Previous Close
Add Transaction
Day Range
34,500 37,250
Year Range
24,700 92,000
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Summary

403870 closed today higher at ₩36,950, an increase of 7.4128% from yesterday's close, completing a monthly decrease of -32.6958% or -₩17,950. Over the past 12 months, 403870 stock gained 10.2985%.
403870 pays dividends to its shareholders, with the most recent payment made on Apr 10, 2026. The next estimated payment will be in In 7 months on Apr 10, 2027 for a total of ₩600.
The last earnings report, released on Mar 25, 2026, missed the consensus estimates by -274%. On average, the company has fell short of earnings expectations by -82.1255%, based on the last three reports.
HPSP Co., Ltd. has completed 1 stock splits, with the recent split occurring on Mar 16, 2023.
The company's stock is traded on 2 different exchanges and in various currencies, with the primary listing on KRX SM (KRW).

403870 Chart

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HPSP Co., Ltd. (403870) FAQ

What is the stock price today?

The current price is ₩36,950.00.

On which exchange is it traded?

HPSP Co., Ltd. is listed on KRX SM.

What is its stock symbol?

The ticker symbol is 403870.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 150%.

What is its market cap?

As of today, the market cap is 2.24T.

Has HPSP Co., Ltd. ever had a stock split?

HPSP Co., Ltd. had 1 splits and the recent split was on Mar 16, 2023.

HPSP Co., Ltd. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
- CEO
KRX SM Exchange
KR7403870009 ISIN
KR Country
- Employees
29 Dec 2025 Last Dividend
- Last Split
- IPO Date

Overview

HPSP Co., Ltd is a distinguished entity in the realm of semiconductor manufacturing, deeply involved in the design, production, and international distribution of high-pressure annealing semiconductor equipment. Since its inception in 2005, the company has solidified its presence in the semiconductor industry, operating from its headquarters in Suwon, South Korea. HPSP Co., Ltd's commitment to innovation and quality has enabled it to serve a broad international market, offering cutting-edge solutions tailored to meet the evolving needs of semiconductor manufacturing.

Products and Services

  • GENI-SYS - This is a high-pressure thermal processing advance system designed for semiconductor manufacturing. The GENI-SYS system is tailored to enhance the thermal processing of semiconductors, leveraging high-pressure techniques to improve efficiency and output quality.
  • GENI - Acting as a cornerstone in HPSP Co., Ltd's product lineup, the GENI system is a high-pressure thermal processing system. It is engineered to provide semiconductor manufacturers with a reliable and efficient solution for high-pressure thermal treatment, crucial for the advancement of semiconductor technology.
  • GENI-SE - The GENI-SE system stands as a high-pressure oxidation system. It is developed to meet the specific needs of semiconductor production that requires high-pressure oxidation processes, ensuring superior quality and performance of the semiconductors produced.

In addition to these innovative products, HPSP Co., Ltd extends a comprehensive suite of services to support its products fully. This includes the provision of parts, repair and exchange services for those parts, installation support to ensure efficient setup and functioning of the equipment, and technical support services to address any operational issues and to optimize the use of their systems. HPSP Co., Ltd is dedicated to providing end-to-end solutions to its clients, ensuring not just the delivery of advanced equipment but also the necessary support to maximize their investment.

Contact Information

Address: 65, Omokcheon-ro 152 beon-gil
Phone: 82 3 1227 9898