Quang Viet Enterprise Co., Ltd. (4438)

Overview

Powertech Technology Inc., established in 1997 and headquartered in Hsinchu City, Taiwan, operates in the semiconductor industry on a global scale. The company's business activities encompass a wide range of processes critical to the development and manufacture of integrated circuit (IC) products. With its subsidiaries, Powertech Technology Inc. conducts in-depth research, design, development, assembling, manufacturing, packaging, testing, and sales of various IC components. It serves clients in diverse locations including Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and other international markets. The firm is also engaged in other semiconductor-related services such as metal surface treatment and investment in wafer probing testing activities.

Products and Services

Powertech Technology Inc. offers a comprehensive range of services within the semiconductor manufacturing process:

• Chip Probing and Final Test: This service involves the initial electrical testing of the silicon wafer—a precursor to the final IC product—and the final testing of the completed chips to ensure functionality.
• IC Packaging Services: The company provides advanced packaging solutions, including:
  • Wafer Level Packaging: A process where ICs are packaged while still part of the wafer, significantly reducing package size.
  • Flip Chips: A method that connects semiconductor devices to external circuitry with conductive bumps on the chip surface.
  • Wire Bond BGA: Ball Grid Array packaging using wire bonds to connect the chip to the package.
  • Lead Frame: A packaging technique that uses a metal frame to support silicon chips and connect them to external circuits.
  • System in Package: Combining multiple integrated circuits within a single package to perform a complete system or subsystem function.
• Module Assembly Services: These services include the assembly of semiconductor modules, ensuring that various components are correctly integrated to work together as intended.
• Design, Manufacturing, Assembly, and Testing of Semiconductors: Beyond packaging and assembly, Powertech Technology Inc. takes part in the complete lifecycle of semiconductor production, including design and testing phases.
• Metal Surface Treatment on Semiconductor Wire Frame: This involves the treatment of metal surfaces to improve the connectivity and durability of semiconductor components.
• Metal Plating on Semiconductor Lead Frame: A process that adds a metal layer on the semiconductor lead frame to enhance electrical conductivity and resistance to corrosion.