FineTek Co., Ltd. logo

FineTek Co., Ltd. (4549)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
91. 40
+0.5
+0.5501%
NT$
- Market Cap
- P/E Ratio
- Div Yield
15,000 Volume
- Eps
NT$ 90.9
Previous Close
Add Transaction
Day Range
90.5 92.3
Year Range
82.9 146.08
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Summary

4549 closed today higher at NT$91.4, an increase of 0.5501% from yesterday's close, completing a monthly decrease of -8.6% or -NT$8.6. Over the past 12 months, 4549 stock lost -16.5297%.
4549 pays dividends to its shareholders, with the most recent payment made on Aug 21, 2025. The next announced payment will be in In 1 weeks on Aug 21, 2026 for a total of NT$3.
The last earnings report, released on Mar 18, 2026, missed the consensus estimates by -2.53%. On average, the company has fell short of earnings expectations by -2.53%, based on the last three reports.
FineTek Co., Ltd. has completed 10 stock splits, with the recent split occurring on Sep 02, 2025.
The company's stock is traded on 2 different exchanges and in various currencies, with the primary listing on KRX SM (KRW).

4549 Chart

FineTek Co., Ltd. (4549) FAQ

What is the stock price today?

The current price is NT$91.40.

On which exchange is it traded?

FineTek Co., Ltd. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 4549.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, no market cap data is available.

Has FineTek Co., Ltd. ever had a stock split?

FineTek Co., Ltd. had 10 splits and the recent split was on Sep 02, 2025.

FineTek Co., Ltd. Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
- CEO
TWSE Exchange
TW0004549001 ISIN
South Korea Country
91 Employees
- Last Dividend
22 May 2026 Last Split
- IPO Date

Overview

Founded in 2008 and based in Seoul, South Korea, Finetek Co., Ltd. has established itself as a pivotal developer, manufacturer, and international seller of a comprehensive range of display parts. The company delves deep into technological innovation to offer advanced solutions in the realm of display technology. With a significant focus on both domestic and international markets, Finetek Co., Ltd. strives to pave the way in the display manufacturing industry by leveraging cutting-edge technology and extensive research and development efforts. Their products and services cater to a variety of applications, from consumer electronics to industrial equipment, demonstrating a versatile and dynamic approach to meeting the needs of a rapidly evolving technology landscape.

Products and Services

  • Digitizers ACF Bonding: Specialized bonding technology used for attaching display components with high precision and durability.
  • Touch Key Systems: Innovative interfaces that utilize touch technology for user input, enhancing the interactivity and user experience of devices.
  • Air Touch Systems: Cutting-edge technology that allows users to interact with devices through gesture recognition, eliminating the need for physical contact.
  • Panel Loader: Equipment designed for the efficient loading of panels in the manufacturing process, ensuring accuracy and speed.
  • Cleaning M/C: Machinery tailored for the thorough cleaning of display components, crucial for maintaining the integrity of the manufacturing process.
  • COG/COF/COP Bonding: Technologies used for the precise and secure attachment of chip-on-glass, chip-on-film, and chip-on-plastic components, essential for modern display manufacturing.
  • Auto Optical Inspection and Resistance Tester: Automated tools for inspecting the optical properties and testing the resistance of display components, ensuring quality and reliability.
  • Flexible Printed Circuit: Solutions for the manufacturing of flexible printed circuits, which are vital for creating flexible and compact electronic devices.
  • Cover Resin Dispensers: Equipment used for the precise application of resin in display manufacturing, contributing to the durability and quality of the final product.
  • Equipment for 2D Print: Specialized printing machinery for creating two-dimensional components, used in various stages of the manufacturing process.
  • FOG/FOF/FOP Bonding: Advanced bonding technologies for film-on-glass, film-on-film, and film-on-plastic applications, supporting the development of high-quality displays.
  • Rigid and Hybrid Inline System: Systems designed for the integration of rigid and flexible components, facilitating the production of versatile display technologies.
  • Foldable Phone System: Tailored equipment and solutions for the manufacturing of foldable phone displays, addressing the cutting-edge segment of the smartphone market.
  • Secondary Battery Equipment: Machinery and technology for the production of secondary batteries, underpinning the power sources of modern electronic devices.
  • Electronic Shelf Label System: An innovative information management solution that enables dynamic pricing and product information updates in retail settings.

Contact Information

Address: 202, 38, Mapo-daero
Phone: 82 2 711 7900