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indie Semiconductor, Inc. (INDI) Q1 2025 Earnings Call Transcript
indie Semiconductor, Inc. (NASDAQ:INDI ) Q1 2025 Earnings Conference Call May 12, 2025 5:00 PM ET Company Participants Ashish Gupta - Investor Relations Donald McClymont - Chief Executive Officer and Acting CFO Mark Tyndall - Head, Corporate Development and IR Conference Call Participants Craig Ellis - B. Riley Securities Ross Seymore - Deutsche Bank Anthony Stoss - Craig Hallum Cody Acree - The Benchmark Company Jon Tanwanteng - CJS Securities Operator Good afternoon.
Indie Semiconductor, Inc. (INDI) Reports Q1 Loss, Lags Revenue Estimates
Indie Semiconductor, Inc. (INDI) came out with a quarterly loss of $0.08 per share in line with the Zacks Consensus Estimate. This compares to loss of $0.10 per share a year ago.
indie Semiconductor Reports First Quarter 2025 Results
ALISO VIEJO, Calif.--(BUSINESS WIRE)--indie Semiconductor, Inc. (Nasdaq: INDI), an automotive solutions innovator, today announced first quarter results for the period ended March 31, 2025. Q1 revenue was up 3.3 percent year-over-year to $54.1 million with Non-GAAP gross margin of 49.5 percent. On a GAAP basis, first quarter 2025 operating loss was $38.9 million compared to $49.6 million a year ago. Non-GAAP operating loss for the first quarter of 2025 was $15.1 million, versus $17.2 million du.
Indie Semiconductor, Inc. Dividends
Indie Semiconductor, Inc. Earnings
| 13 May 2025 Date | | - Cons. EPS | - EPS |
| 21 Feb 2025 Date | | - Cons. EPS | - EPS |
| 11 Nov 2024 Date | | - Cons. EPS | - EPS |
| 7 Nov 2024 Date | | - Cons. EPS | - EPS |
| 12 Aug 2024 Date | | - Cons. EPS | - EPS |
| 13 May 2025 Date | | - Cons. EPS | - EPS |
| 21 Feb 2025 Date | | - Cons. EPS | - EPS |
| 11 Nov 2024 Date | | - Cons. EPS | - EPS |
| 7 Nov 2024 Date | | - Cons. EPS | - EPS |
| 12 Aug 2024 Date | | - Cons. EPS | - EPS |
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Indie Semiconductor, Inc. Profile
| Semiconductors Industry | Technology Sector | Mr. Donald McClymont CEO | XMUN Exchange | US45569U1016 ISIN |
| US Country | 920 Employees | - Last Dividend | - Last Split | 10 Jun 2021 IPO Date |
Overview
Indie Semiconductor, Inc. is at the forefront of automotive semiconductor and software solutions, catering to the evolving needs of advanced driver assistance systems, autonomous vehicles, in-cabin monitoring, connected cars, and vehicle electrification. The company boasts a broad geographical presence, serving clients across the United States, South America, North America, Greater China, South Korea, the rest of the Asia Pacific, and Europe. Founded in 2007, indie Semiconductor has established its headquarters in Aliso Viejo, California, marking its influence in the global automotive technology landscape.
Products and Services
Indie Semiconductor, Inc. offers a wide array of products and services designed to enhance automotive safety, performance, and connectivity. The company's portfolio includes:
- Ultrasonic Sensors: Employed for parking assistance, these sensors help drivers navigate tight spots by detecting nearby objects and alerting the driver accordingly.
- Radar Sensors: These are integral for audio assistance systems and providing reverse driving information, enhancing vehicle safety and driver awareness.
- Front Cameras: Used for vehicle detection, collision avoidance, and traffic sign reading, front cameras play a crucial role in modern advanced driver assistance systems (ADAS).
- Side/Inside Cameras: These cameras assist with blind spot detection and lane change, in addition to monitoring driver behavior, thus contributing to road safety and reducing the likelihood of accidents.
- LiDAR: Key for distance and speed measurement, obstacle detection, collision avoidance, and powering emergency brake systems, LiDAR technology is vital for autonomous driving applications.
- Long Range RADAR: This technology supports audio assistance, ACC stop and go functionality, and obstacle detection, bolstering the vehicle's safety mechanisms.
- Photonic Components: Indie Semiconductor also specializes in the design and manufacture of advanced photonic components, leveraging fiber Bragg gratings, low-noise lasers, athermal and tunable packaging, photonic integration, and high-speed electronics to meet diverse technological needs.
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