Lcy Technology Corp. logo

Lcy Technology Corp. (4989)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
68. 00
+0.5
+0.7407%
NT$
3.82B Market Cap
- P/E Ratio
2% Div Yield
12.22M Volume
- Eps
NT$ 67.5
Previous Close
Add Transaction
Day Range
67.2 71.4
Year Range
24.2 125
Want to track 4989 and more in your Portfolio? 🎯
Sign up for Marketlog, a portfolio tracker that will exceed your expectations!

Summary

4989 closed today higher at NT$68, an increase of 0.7407% from yesterday's close, completing a monthly decrease of -24.5283% or -NT$22.1. Over the past 12 months, 4989 stock gained 26.3941%.
4989 is not paying dividends to its shareholders.
The last earnings report, released on Mar 12, 2026, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
Lcy Technology Corp. has completed 1 stock splits, with the recent split occurring on Nov 18, 2021.
The company's stock is traded on one exchange.

4989 Chart

People also search for

Tang Eng Iron Works Co., Ltd.
NT$ 26.8
-0.7407%
Chia Hsin Cement Corporation
NT$ 13.2
0%
Shin Hai Gas Corporation
NT$ 49.05
-0.5071%
China Steel Structure Co., Ltd.
NT$ 41.4
+0.1209%
Sesoda Corporation
NT$ 49.25
-1.4014%

Lcy Technology Corp. (4989) FAQ

What is the stock price today?

The current price is NT$68.00.

On which exchange is it traded?

Lcy Technology Corp. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 4989.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 2%.

What is its market cap?

As of today, the market cap is 3.82B.

Has Lcy Technology Corp. ever had a stock split?

Lcy Technology Corp. had 1 splits and the recent split was on Nov 18, 2021.

Lcy Technology Corp. Profile

Metals & Mining Industry
Materials Sector
Chia-He Liu CEO
TWSE Exchange
TW0004989009 ISIN
TW Country
- Employees
1 Aug 2023 Last Dividend
18 Nov 2021 Last Split
- IPO Date

Overview

Founded in 1997 and headquartered in Taipei City, Taiwan, LCY Technology Corp. specializes in the manufacture and sale of copper foil products. Catering to the needs of printed circuit board and copper clad laminate manufacturers both within Taiwan and on a global scale, LCY Technology Corp. leverages its expertise and extensive product line to serve a diverse clientele in the electronics industry. Through their commitment to quality and innovation, they have established a respectable position in the market.

Products and Services

  • 4oz Copper Foils - Thick copper foils designed for high-power circuit boards, offering durability and increased electrical conductivity.
  • 3oz Copper Foils - These foils provide a good balance between thickness and flexibility, suitable for a variety of electrical applications.
  • 2oz Copper Foils - Medium-thickness foils that cater to general printed circuit board manufacturing, known for their versatility.
  • 1oz Copper Foils - Thin foils used in intricate circuit board designs, where precision and high-density connections are required.
  • 1/2oz Copper Foils - Even thinner copper foils, ideal for flexible printed circuits and high-precision applications.
  • 1/3oz Copper Foils - These ultra-thin foils are perfect for advanced electronic devices, where space saving and fine details are crucial.
  • 9µm Copper Foils - Among the thinnest foils offered, used for high-end applications needing maximum precision and minimal weight.
  • 7µm Copper Foils - The thinnest copper foils available, catering to cutting-edge technology requirements such as in smartphones and other slim devices.
  • Thin Copper Foils - This category encompasses a range of low thickness foils tailored for specific applications that require minimal profile with high conductivity.
  • Very Low Profile Copper Foils - Designed for ultra-smooth surfaces, these foils are essential in creating high-frequency and high-speed electronic circuits.
  • Reverse Treatment Copper Foils - Offeringa unique surface treatment that enhances bonding with other materials, these foils are crucial for multi-layer circuit boards.
  • Very Low Profile RTF - Combining the benefits of very low profile surfaces with reverse treatment, these foils are used for superior adhesion in complex electronic components.

Contact Information

Address: No.83, Bade Road, Taipei, Taiwan, 105
Phone: 886 2 2763 1611