Arisawa Mfg Co., Ltd. logo

Arisawa Mfg Co., Ltd. (5208)

Market Closed
10 Aug, 06:00
JPX JPX
¥
2,670. 00
-80
-2.9091%
¥
56.61B Market Cap
- P/E Ratio
156% Div Yield
265,100 Volume
- Eps
¥ 2,750
Previous Close
Add Transaction
Day Range
2,651 2,781
Year Range
1,513 2,868
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Summary

5208 closed yesterday lower at ¥2,670, a decrease of -2.9091% from Friday's close, completing a monthly increase of 0.7547% or ¥20. Over the past 12 months, 5208 stock gained 54.7826%.
5208 pays dividends to its shareholders, with the most recent payment made on Dec 01, 2025. The next announced payment will be in In 1 month on Sep 30, 2026 for a total of ¥49.
The last earnings report, released on Apr 30, 2026, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
Arisawa Mfg Co., Ltd. has completed 4 stock splits, with the recent split occurring on Mar 28, 2005.
The company's stock is traded on 2 different exchanges and in various currencies, with the primary listing on JPX (JPY).

5208 Chart

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Arisawa Mfg Co., Ltd. (5208) FAQ

What is the stock price today?

The current price is ¥2,670.00.

On which exchange is it traded?

Arisawa Mfg Co., Ltd. is listed on JPX.

What is its stock symbol?

The ticker symbol is 5208.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 156%.

What is its market cap?

As of today, the market cap is 56.61B.

Has Arisawa Mfg Co., Ltd. ever had a stock split?

Arisawa Mfg Co., Ltd. had 4 splits and the recent split was on Mar 28, 2005.

Arisawa Mfg Co., Ltd. Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
Mr. Yuta Arisawa CEO
JPX Exchange
JP3126000003 ISIN
Japan Country
1,498 Employees
30 Sep 2026 Last Dividend
28 Mar 2005 Last Split
- IPO Date

Overview

Arisawa Mfg. Co., Ltd. is a prominent manufacturer and international distributor of a wide array of materials used in the electronic, optoelectronic, electrical insulating, display, and industrial structural sectors. Established in 1909, the company is headquartered in Joetsu, Japan, and has earned a reputation for its extensive range of high-quality products that cater to various industry needs. Arisawa’s commitment to innovation and quality has positioned it as a key player in its field, serving customers worldwide with its advanced material solutions.

Products and Services

  • Flexible Printed Circuit Materials: This category includes a range of materials such as Polyimide (PI), photosensitive compounds, and others, tailored for use in flexible printed circuits.
  • Copper-Clad Laminates: These laminates are essential for the production of printed circuit boards, providing the necessary electrical insulation and support.
  • Interlayer Adhesive Sheets: Utilized in the lamination process, these sheets act as bonding agents between various layers in electronic components and display technologies.
  • PI Composite and Protection Films: These films are designed to protect and enhance the durability of electronic parts, ensuring their longevity and reliability.
  • Optical Materials: Arisawa offers a variety of optical materials including projection screens for enhanced image quality, UV nanoimprinting products for precise patterning, optical retardation elements to control light properties, 3D products for immersive visual experiences, and comprehensive film and glass lamination services.
  • Fabric Products: The company's fabric offerings encompass a diverse range such as glass cloth and tapes, carbon cloth, and braided and other fabric products, catering to multiple industrial uses.
  • General Coating Products: This includes a range of coated products like pre-pregs, glass cloth silicon rubber tapes, semi-conductive tapes, adhesive tapes, composite adhesive tapes, and resin impregnated glass-cloth tapes, serving various application needs.
  • Glass and Carbon Fiber Filament Winding Moldings, Pultrusion Products, Compression Molding Products, and Cryogenic Cooling Vessels: Arisawa manufactures a broad spectrum of composite materials and structures, including those made through filament winding, pultrusion, and compression molding processes, alongside specialized cryogenic cooling vessels for high-performance applications.

Contact Information

Address: Minami-honcho 1-5-5
Phone: 81 2 5524 5121