Tongling Zhongfa Trinity Co., Ltd. logo

Tongling Zhongfa Trinity Co., Ltd. (600520)

Market Closed
11 Aug, 06:57
SSE SSE
¥
25. 15
-0.01
-0.0397%
¥
5.44B Market Cap
- P/E Ratio
0.2% Div Yield
7.19M Volume
- Eps
¥ 25.16
Previous Close
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Day Range
24.62 25.41
Year Range
20.35 40.4
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Summary

600520 closed today lower at ¥25.15, a decrease of -0.0397% from yesterday's close, completing a monthly decrease of -35.5128% or -¥13.85. Over the past 12 months, 600520 stock gained 2.0698%.
600520 is not paying dividends to its shareholders.
The last earnings report, released on May 16, 2025, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
Tongling Zhongfa Trinity Co., Ltd. has completed 1 stock splits, with the recent split occurring on Jun 16, 2003.
The company's stock is traded on one exchange.

600520 Chart

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Tongling Zhongfa Trinity Co., Ltd. (600520) FAQ

What is the stock price today?

The current price is ¥25.15.

On which exchange is it traded?

Tongling Zhongfa Trinity Co., Ltd. is listed on SSE.

What is its stock symbol?

The ticker symbol is 600520.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 0.2%.

What is its market cap?

As of today, the market cap is 5.44B.

Has Tongling Zhongfa Trinity Co., Ltd. ever had a stock split?

Tongling Zhongfa Trinity Co., Ltd. had 1 splits and the recent split was on Jun 16, 2003.

Tongling Zhongfa Trinity Co., Ltd. Profile

Machinery Industry
Industrials Sector
Mr. Ning Ding CEO
SSE Exchange
CNE0000019N5 ISIN
CN Country
635 Employees
23 Jun 2005 Last Dividend
16 Jun 2003 Last Split
19 Dec 2001 IPO Date

Overview

WenYi Trinity Technology Co., Ltd is a distinguished entity involved in the research and development of advanced molds and equipment technology, catering to the semiconductor and chemical building materials industries both in China and on a global scale. The company's journey began in 2000 under the name Tongling Zhongfa Sanjia Technology Co., Ltd, undertaking a significant rebranding to WenYi Trinity Technology Co., Ltd in 2011. With its headquarters in Tongling, China, WenYi Trinity Technology has established a reputation for its innovative solutions and contributions to the industries it serves.

Products and Services

  • Semiconductor Integrated Circuits Packaging Molds and Equipment

    This range of products includes specialized molds and equipment designed for the packaging of semiconductor integrated circuits. These solutions are critical for ensuring the reliability and performance of semiconductor devices, meeting the stringent requirements of the industry.

  • Plastic Profile Extrusion Molds and Equipment

    WenYi Trinity Technology offers molds and equipment for the extrusion of plastic profiles, catering to a wide range of applications in construction, automotive, and industrial sectors. Their technologies enable efficient production of high-quality plastic profiles.

  • Belt Conveyor Idler Bearing Housings and Seals

    The company provides durable and high-performance bearing housings and seals for belt conveyor idlers. These components are essential for the smooth operation of conveyor systems in various industries, ensuring reliability and longevity.

Contact Information

Address: Electronic Industrial Zone, Tongling, China, 244000
Phone: 86 56 2262 7780