Quick Intelligent Equipment Co., Ltd. (603203)

Overview

Quick Intelligent Equipment Co., Ltd. is a leading entity in the field of precision assembly technology relevant to the electronics sector, serving clients both within China and on an international scale. Established in 1993, with its headquarters rooted in Changzhou, China, the company dedicates itself to the advancement of research and development, alongside manufacturing and sales efforts. Quick Intelligent Equipment Co., Ltd. boasts a comprehensive portfolio that covers everything from machine vision process equipment to die-bonding, packaging equipment, and beyond, addressing the intricate demands of modern electronic manufacturing with smart, innovative solutions.

Products and Services

• Machine Vision Process Equipment: Utilizing advanced imaging systems to enhance manufacturing precision through visual inspection and automation.
• Die-Bonding and Packaging Equipment: Offering robust solutions for integrated circuit assembly, enabling efficient and reliable packaging of electronic components.
• Intelligent Manufacturing Complete Sets of Equipment: Delivering comprehensive solutions that incorporate smart technologies for optimized production processes in the electronics manufacturing industry.
• Precision Welding and Assembly Equipment: Facilitating high-precision joining methods crucial for electronic component manufacturing, ensuring durability and performance.
• Hot Pressure Soldering Automated Production Line: Streamlining soldering processes with automated solutions for improved throughput and consistency in electronics assembly.
• Automated Production Line for Millimeter Wave Radar: Specialized in manufacturing lines that cater to the growing demand for millimeter wave radar technology, pertinent in various sectors including automotive safety.
• PTC AND EUC Production Line: Equipment tailored for the production of Positive Temperature Coefficient (PTC) and Electrically Operated Unit Controllers (EUC), essential components in modern electronic devices.
• High Speed Die Bonder: Equipment designed for precise placement of chips in semiconductor packaging, crucial for high-volume electronics manufacturing.
• Vacuum Soldering System: Offering a controlled environment for soldering, critical for enhancing the quality and reliability of electronic assemblies.
• On-line Formic Soldering System: Innovative soldering solutions that leverage formic acid to enable high-quality solder joints, especially in oxygen-sensitive environments.
• Silver Sintering Equipment: Providing cutting-edge solutions for creating strong, reliable inter-metallic compounds used in high-reliability electronic assemblies.
• Power Device Packaging: Advanced packaging solutions that cater to the unique requirements of power electronic devices, enhancing performance and efficiency.
• Module, Intelligent Terminal, Metaverse: Offering integrated solutions that support the development of advanced computing modules, intelligent terminals, and immersive virtual reality experiences within the Metaverse context.
• Electro-optic Display: Providing technology solutions for the manufacturing of electro-optic displays, essential for consumer electronics, automotive displays, and other applications.
• AOI: Automated Optical Inspection systems designed to detect a wide range of manufacturing defects, crucial for quality control in electronics production.
• Soldering Tools and Equipment: A wide range of soldering solutions including selective soldering, laser soldering, hotbar soldering, and precision dispensing, tailored to meet diverse manufacturing needs.