Nidec Chaun-Choung Technology Corp. logo

Nidec Chaun-Choung Technology Corp. (6230)

Market Closed
12 Jun, 05:30
TWSE TWSE
NT$
133. 00
+1.5
+1.1407%
NT$
16.02B Market Cap
- P/E Ratio
- Div Yield
43,000 Volume
- Eps
NT$ 131.5
Previous Close
Add Transaction
Day Range
131 135
Year Range
105.5 190.5
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Summary

6230 closed yesterday higher at NT$133, an increase of 1.1407% from Thursday's close, completing a monthly decrease of -5.3381% or -NT$7.5. Over the past 12 months, 6230 stock gained 15.6522%.
6230 pays dividends to its shareholders, with the most recent payment made on Sep 15, 2025. The next estimated payment will be in In 3 months on Sep 15, 2026 for a total of NT$0.222.
The last earnings report, released on May 05, 2026, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
Nidec Chaun-Choung Technology Corp. has completed 5 stock splits, with the recent split occurring on Sep 02, 2008.
The company's stock is traded on one exchange.

6230 Chart

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Nidec Chaun-Choung Technology Corp. (6230) FAQ

What is the stock price today?

The current price is NT$133.00.

On which exchange is it traded?

Nidec Chaun-Choung Technology Corp. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 6230.

Does it pay dividends? What is the current yield?

It does not pay dividends to its shareholders.

What is its market cap?

As of today, the market cap is 16.02B.

Has Nidec Chaun-Choung Technology Corp. ever had a stock split?

Nidec Chaun-Choung Technology Corp. had 5 splits and the recent split was on Sep 02, 2008.

Nidec Chaun-Choung Technology Corp. Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
Mr. Akihiro Miyoshi CEO
TWSE Exchange
TW0006230006 ISIN
TW Country
- Employees
22 Aug 2025 Last Dividend
2 Sep 2008 Last Split
- IPO Date

Overview

Nidec Chaun-Choung Technology Corporation, with its origins as Chaun-Choung Technology Corp., refined its market presence by rebranding in January 2021. Since its inception in 1973, the company has established itself as a key player in the field of thermal management products and heat dissipation components. Operating from its headquarters in New Taipei City, Taiwan, the company has extended its services and product offerings internationally. It specializes in producing, processing, and trading a comprehensive range of thermal solutions and components, catering to various sectors including computing, LED lighting, and more, ensuring optimal cooling and thermal management across a diverse range of applications.

Products and Services

  • Server/DT, NB/Tablet, and LED Modules

    These modules are designed for specific applications across servers, desktops, notebooks/tablets, and LED lighting solutions. They focus on enhancing the thermal performance and efficiency of these devices through advanced heat dissipation technologies.

  • Thermal Components
    • Heatsinks

      Employed in various electronic devices to cool components by dissipating heat into the surrounding air.

    • Thermal Modules

      Complex assemblies that may include a combination of heatsinks, heat pipes, and fans to provide effective cooling solutions for electronic devices.

    • Thermal Systems

      Comprehensive solutions designed to manage the thermal requirements of complex electronic systems, ensuring optimal performance and longevity.

    • Vapor Chambers

      Advanced cooling technologies that utilize phase change and advanced thermal conductive materials to transport heat efficiently.

    • Heat Pipes

      Components that transfer heat from one point to another, utilizing the evaporation and condensation of a fluid to effectively manage thermal conditions.

  • Design and Development Services

    Nidec Chaun-Choung Technology Corporation offers heat dissipation product design and optimal cooling solutions, catering to specific needs and challenges. Additionally, the company engages in the research and development, production, and sales of innovative computer cooling modules and thermal cooling components, demonstrating its comprehensive approach to thermal management.

  • Micro Heat Plates

    These components are designed for applications requiring high precision in thermal management, leveraging the latest advancements in micro-scale heat transfer to provide effective cooling.

Contact Information

Address: No.184-3, Zhongxing North street, New Taipei City, Taiwan, 24158
Phone: 886 2 2995 2666