Tesec Corp. (6337)

Overview

TESEC Corporation is a pioneer in the semiconductor testing industry, with its origins tracing back to 1969 when it was originally founded as TES Corporation. It has since evolved, adopting the name TESEC Corporation in 1980, and establishing its headquarters in Tokyo, Japan. The company enjoys a prestigious reputation both domestically and internationally for designing, developing, manufacturing, and selling advanced semiconductor test equipment. TESEC Corporation's wide-ranging suite of offerings caters to a diverse set of needs within the semiconductor industry, underpinning its commitment to innovation, quality, and customer service. Beyond its core product offerings, TESEC extends its expertise through a comprehensive array of after-sales services, emphasizing its dedication to customer satisfaction and operational excellence.

Products and Services

• Discrete Device Test Systems: These systems are designed for the testing of individual semiconductor devices for functionality and performance. They help ensure that each unit meets the required specifications for electronic circuits.
• Thermal Resistance Testers: Utilized for measuring the thermal resistance of semiconductor devices. This is crucial for predicting their performance and reliability, especially under conditions of heat stress.
• Inductive Load Testers: These systems are designed to test semiconductor devices under inductive load conditions, simulating real-world scenarios to validate device durability and functionality.
• Dynamic Test Systems: Focused on evaluating semiconductor devices under dynamic or changing conditions to ensure they perform reliably over their expected lifespan. This includes testing for a variety of electrical parameters under different conditions.
• IPD/IPM Test Systems: Specifically tailored for Integrated Power Devices (IPDs) and Intelligent Power Modules (IPMs), these systems verify the performance of power semiconductor devices, which are critical for power management and conversion applications.
• Handlers: TESEC offers a variety of handling systems, including:
  • Micro Electro Mechanical Systems (MEMS) Handlers: For precise testing of MEMS devices,
  • Film Frame Test Handlers: Suited for testing devices still on the film frame,
  • Gravity Handlers: Utilize gravity to position devices for testing, and
  • TAB Handlers: Designed for testing devices in Tape Automated Bonding (TAB) packages.
• Die Sorters: Equipment designed for sorting semiconductor dies based on test results, enhancing the efficiency of the semiconductor manufacturing process.
• After-Sales Services: TESEC supports its products beyond the sale with comprehensive services, including:
  • Tester Calibration: Ensuring equipment remains accurate over time,
  • Overhaul: Comprehensive servicing to maintain optimal performance,
  • Training Services: Educating clients on how to use the equipment effectively,
  • Spare Parts, Warranty, Maintenance, and Resale Services: Offering a full range of support options to keep testing operations running smoothly.