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Samco Inc. (6387)

Market Open
10 Aug, 06:00
JPX JPX
¥
9,160. 00
+330
+3.7373%
¥
30.96B Market Cap
- P/E Ratio
240% Div Yield
73,700 Volume
- Eps
¥ 8,830
Previous Close
Add Transaction
Day Range
8,850 9,220
Year Range
2,750 16,930
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Summary

6387 trading today higher at ¥9,160, an increase of 3.7373% from yesterday's close, completing a monthly decrease of -36.6528% or -¥5,300. Over the past 12 months, 6387 stock gained 96.3558%.
6387 pays dividends to its shareholders, with the most recent payment made on Jul 30, 2026. The next estimated payment will be in In 11 months on Jul 30, 2027 for a total of ¥75.
The last earnings report, released on Mar 10, 2026, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
Samco Inc. has completed 2 stock splits, with the recent split occurring on Jul 27, 2011.
The company's stock is traded on one exchange.

6387 Chart

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Samco Inc. (6387) FAQ

What is the stock price today?

The current price is ¥9,160.00.

On which exchange is it traded?

Samco Inc. is listed on JPX.

What is its stock symbol?

The ticker symbol is 6387.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 240%.

What is its market cap?

As of today, the market cap is 30.96B.

Has Samco Inc. ever had a stock split?

Samco Inc. had 2 splits and the recent split was on Jul 27, 2011.

Samco Inc. Profile

Semiconductors & Semiconductor Equipment Industry
Information Technology Sector
Mr. Osamu Tsuji CEO
JPX Exchange
JP3322950001 ISIN
Japan Country
175 Employees
30 Jul 2026 Last Dividend
27 Jul 2011 Last Split
- IPO Date

Overview

SAMCO Inc. is a globally recognized semiconductor and materials company, with a strong presence in the field of thin film deposition, microfabrication, cleaning, and surface treatment technologies. Originally known as SAMCO International, Inc., the company underwent a name change to SAMCO Inc. in December 2004. Founded in 1979, the organization has established its headquarters in Kyoto, Japan. Over the years, SAMCO Inc. has dedicated itself to providing advanced equipment solutions, catering to the growing demands of the semiconductor industry and beyond.

Products and Services

  • Thin Film Deposition Systems:

    SAMCO Inc. offers a diverse range of deposition systems, including Atomic Layer Deposition (ALD) systems, Plasma Enhanced Chemical Vapor Deposition (PECVD) systems, Liquid Source CVD systems, and Diamond-Like Carbon Coating systems. These systems are designed for the precise deposition of thin films over various substrates, catering to semiconductor manufacturing, surface coating, and material research applications.

  • Etching Systems:

    The company's etching equipment portfolio includes Inductively Coupled Plasma (ICP), Silicon Deep Reactive Ion, Reactive Ion, and Xenon Difluoride etching systems. These systems are engineered to provide high-precision etching capabilities, essential for the fabrication of microelectronic components, semiconductors, and nanotechnology devices.

  • Plasma Processing Equipment:

    Under plasma processing, SAMCO Inc. showcases the Aqua Plasma cleaner, known for its ability to efficiently clean and prepare surfaces for further processing. This is complemented by an array of plasma and UV ozone cleaners, designed to remove organic contaminants and enhance surface wettability, crucial steps in device fabrication and research settings.

Contact Information

Address: 36 Waraya-cho
Phone: 81 7 5621 7841