Gallant Micro Machining Co., Ltd. logo

Gallant Micro Machining Co., Ltd. (6640)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
945. 00
-60
-5.9701%
NT$
- Market Cap
- P/E Ratio
80% Div Yield
679,861 Volume
- Eps
NT$ 1,005
Previous Close
Add Transaction
Day Range
941 1,105
Year Range
520 1,860
Want to track 6640 and more in your Portfolio? 🎯
Sign up for Marketlog, a portfolio tracker that will exceed your expectations!

Summary

6640 closed today lower at NT$945, a decrease of -5.9701% from yesterday's close, completing a monthly decrease of -9.1346% or -NT$95. Over the past 12 months, 6640 stock gained 45.8333%.
6640 pays dividends to its shareholders, with the most recent payment made on Jul 10, 2026. The next estimated payment will be in In 10 months on Jul 10, 2027 for a total of NT$15.
The last earnings report, released on May 12, 2026, missed the consensus estimates by -3.82%. On average, the company has fell short of earnings expectations by -3.82%, based on the last three reports.
The stock of the company had never split.
The company's stock is traded on 2 different exchanges and in various currencies, with the primary listing on JPX (JPY).

6640 Chart

Gallant Micro Machining Co., Ltd. (6640) FAQ

What is the stock price today?

The current price is NT$945.00.

On which exchange is it traded?

Gallant Micro Machining Co., Ltd. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 6640.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 80%.

What is its market cap?

As of today, no market cap data is available.

Has Gallant Micro Machining Co., Ltd. ever had a stock split?

No, there has never been a stock split.

Gallant Micro Machining Co., Ltd. Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
Mr. Sean Michael Gregory B.Sc., M.B.A. CEO
TWSE Exchange
TW0006640006 ISIN
AU Country
- Employees
- Last Dividend
- Last Split
- IPO Date

Overview

I-PEX Inc. is a pioneering company engaged in the development, production, and marketing of an extensive range of connectors and electronic components, alongside automotive electronics components, and semiconductor manufacturing equipment primarily within Japan, China, and other parts of Asia. Initially operating under the name Dai-ichi Seiko Co., Ltd., the company underwent a rebranding phase, adopting the name I-PEX Inc. in August 2020. Since its inception in 1963, I-PEX has established its headquarters in Kyoto, Japan, cementing its reputation in the industry through innovation, quality, and a commitment to meeting the diverse needs of its clients.

Products and Services

I-PEX Inc. offers a comprehensive selection of products and services tailored to meet the demanding requirements of today's electronic and automotive industries, as well as the specialized field of semiconductor manufacturing.

  • Connectors: This category comprises a variety of connectors suited for different applications, including:
    • RF Connectors: Designed for radio frequency applications, ensuring high-performance transmission.
    • Micro Coaxial/Discrete Cable Connectors: Ideal for compact and high-density connection requirements, often used in mobile devices and other small form factor electronics.
    • Board to Board Connectors: Facilitates reliable interconnections between different circuit boards, widely utilized in multi-board electronic assemblies.
    • FPC/FFC Connectors: Optimized for flexible printed circuits and flexible flat cables, catering to applications requiring flexible connectivity solutions.
    • I/O Connectors: A broad range of input/output connectors, supporting various interface standards for peripheral device connections.
    • Power Terminals and Connectors: Provides robust power connections, crucial for the stable operation of electronic and electrical equipment.
  • Sensors: A diverse lineup of sensors for automotive, industrial, and consumer electronics applications, enhancing functionality and safety through precise measurements and data collection.
  • Semiconductor Molding Machines: High-precision machinery for the encapsulation of semiconductor devices, ensuring protection and reliability of semiconductor components.
  • Equipment Manufacturing: Delivers specialized manufacturing equipment tailored to customer specifications, supporting a range of industrial processes and requirements.
  • Semiconductor Manufacturing: Offers services encompassing the entire semiconductor production process, from design to manufacturing, catering to the needs of semiconductor industry clients.
  • Contract Manufacturing: Extensive contract manufacturing services, providing clients with flexible manufacturing solutions and operational excellence in product assembly and fabrication.
  • MEMS Foundry Services: Specialized in micro-electromechanical systems (MEMS) production, offering comprehensive solutions from design to mass production of MEMS devices.

Contact Information

Address: 110 Hay Street, Subiaco, WA, Australia, 6000
Phone: 614 3704 6025