Ventec International Group Co., Ltd. logo

Ventec International Group Co., Ltd. (6672)

Market Closed
11 Aug, 05:30
TWSE TWSE
NT$
257. 00
+5.5
+2.1869%
NT$
5.94B Market Cap
- P/E Ratio
13.4% Div Yield
6.95M Volume
- Eps
NT$ 251.5
Previous Close
Add Transaction
Day Range
247 262
Year Range
81.5 330
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Summary

6672 closed today higher at NT$257, an increase of 2.1869% from yesterday's close, completing a monthly decrease of -15.0413% or -NT$45.5. Over the past 12 months, 6672 stock gained 176.6416%.
6672 pays dividends to its shareholders, with the most recent payment made on May 15, 2026. The next estimated payment will be in In 9 months on May 15, 2027 for a total of NT$3.35.
The last earnings report, released on May 11, 2026, exceeded the consensus estimates by 0%. On average, the company has fell short of earnings expectations by -0.6433%, based on the last three reports.
The stock of the company had never split.
The company's stock is traded on one exchange.

6672 Chart

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Ventec International Group Co., Ltd. (6672) FAQ

What is the stock price today?

The current price is NT$257.00.

On which exchange is it traded?

Ventec International Group Co., Ltd. is listed on TWSE.

What is its stock symbol?

The ticker symbol is 6672.

Does it pay dividends? What is the current yield?

Yes, It pays dividends and the current yield is 13.4%.

What is its market cap?

As of today, the market cap is 5.94B.

Has Ventec International Group Co., Ltd. ever had a stock split?

No, there has never been a stock split.

Ventec International Group Co., Ltd. Profile

Electronic Equipment, Instruments & Components Industry
Information Technology Sector
Mr. Chien-Jen Chung CEO
TWSE Exchange
KYG9353A1040 ISIN
TW Country
- Employees
16 Apr 2026 Last Dividend
- Last Split
- IPO Date

Overview

Ventec International Group Co., Ltd., established in 2000 and headquartered in Suzhou, the People's Republic of China, stands as a pivotal entity in the domain of electronics, focusing on the design, development, manufacture, and distribution of copper clad laminates and prepreg bonding materials. Ventec has broadened its operational reach beyond its roots in China, marking its presence in key markets such as the United Kingdom, the United States, Germany, and Taiwan. The company not only excels in its core offerings but also diversifies its portfolio through engagements in general investment and international trade business. This strategic positioning allows Ventec to meet the dynamic needs of printed circuit board fabrication and related applications on a global scale.

Products and Services

Ventec International Group Co., Ltd. offers an elaborate spectrum of products catering to various requirements in the electronics manufacturing industry, meticulously outlined as follows:

  • Standard FR4: A foundational material in PCB manufacturing, known for its durability and reliability in standard applications.
  • Lead-free Assembly: Tailored solutions that support environmentally conscious manufacturing practices without the use of lead.
  • Halogen-Free Products: Offering enhanced safety and reduced environmental impact, these products exclude the use of halogen elements.
  • Tec-Thermal/Thermal Management: Focused on managing heat in electronic devices to improve performance and longevity.
  • Insulated Metal Substrate: Combines metal and insulating layers to support high-power applications.
  • Polyimide: High-performance materials designed for applications that require superior thermal and chemical resistance.
  • Tec-Speed/Signal Integrity and High Frequency Products: Advanced materials that enhance performance in high-speed and high-frequency electronic circuits.
  • Flex/Flex Rigid Products: Offers flexibility and adaptability for unique circuit designs, merging the benefits of flexible and rigid boards.
  • Plastic Interleaver and Release Film Consumables: Essential for the protection and processing of PCB materials during manufacturing.
  • Drill Entry and Exit Material: Specialty materials designed to improve the accuracy and quality of drilled holes in PCB manufacturing.
  • Copper Foils and ACF: Fundamental components for creating conductive paths in PCBs, ensuring high quality electrical connections.
  • Masslam and Drill Products: Solutions tailored for mass lamination and precision drilling processes in high-volume PCB production.
  • Products for Special Applications: Custom materials and technologies developed to meet specific requirements of niche markets or specialized electronic applications.

Contact Information

Address: The Grand Pavilion Commercial Centre, Grand Cayman, Cayman Islands, 32052
Phone: -