China Chippacking Technology Co., Ltd. (688216)
Market Closed
11 Aug, 06:57
SSE SSE Primary ¥
30. 50
-0.42
-1.3583%
¥
2.43B Market Cap
- P/E Ratio
1.6% Div Yield
3.43M Volume
- Eps
¥ 30.92
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Summary
688216 closed today lower at ¥30.5, a decrease of -1.3583% from yesterday's close, completing a monthly decrease of -27.45% or -¥11.54. Over the past 12 months, 688216 stock gained 36.1607%.
688216 is not paying dividends to its shareholders.
The last earnings report, released on Oct 28, 2024, exceeded the consensus estimates by 0%. On average, the company has surpassed earnings expectations by 0%, based on the last three reports.
The stock of the company had never split.
The company's stock is traded on one exchange.
688216 Chart
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China Chippacking Technology Co., Ltd. (688216) FAQ
What is the stock price today?
The current price is ¥30.50.
On which exchange is it traded?
China Chippacking Technology Co., Ltd. is listed on SSE.
What is its stock symbol?
The ticker symbol is 688216.
Does it pay dividends? What is the current yield?
Yes, It pays dividends and the current yield is 1.6%.
What is its market cap?
As of today, the market cap is 2.43B.
Has China Chippacking Technology Co., Ltd. ever had a stock split?
No, there has never been a stock split.
China Chippacking Technology Co., Ltd. Profile
| Semiconductors & Semiconductor Equipment Industry | Information Technology Sector | Mr. Zewei Li CEO | SSE Exchange | CNE100005113 ISIN |
| CN Country | 1,806 Employees | 6 Jul 2022 Last Dividend | - Last Split | - IPO Date |
Overview
China Chippacking Technology Co.,Ltd. is a prominent entity in the sphere of integrated circuit packaging and testing within China. Since its inception in 2006, the company has dedicated itself to delivering unparalleled packaging technology solutions. Operating from its base in Dongguan, China, China Chippacking Technology Co.,Ltd. prides itself on its profound expertise and innovative approaches to meet the evolving demands of the electronics industry. Through its commitment to excellence and continuous improvement, the company aims at bolstering the efficiency and performance of electronic devices across various applications.
Products and Services
The company's portfolio encompasses a wide range of package forms, each designed to cater to different requirements and applications. Below is a breakdown of the products and services offered:
- CPC, ECPC: These packaging solutions are tailored for applications demanding high precision and reliability. They are often used in critical electronics where package integrity is paramount.
- DFN, QFN: The Dual Flat No-leads (DFN) and Quad Flat No-leads (QFN) packages are designed for lightweight, space-efficient applications. They are ideal for portable and compact devices due to their small footprint.
- LQFP: The Low-profile Quad Flat Package (LQFP) is used in applications requiring a low profile in terms of height. It's perfect for systems with limited space, providing a balance between performance and form factor.
- MSOP, DIP: Mini Small Outline Package (MSOP) and Dual In-line Package (DIP) are utilized in a variety of digital and analog applications, offering flexibility with reliable connections for through-hole and surface mount designs.
- QIPAI, EMSOP, SOP: These offerings cater to a broad spectrum of electronic devices, ensuring robust performance and durability. They are versatile in their applications, from consumer electronics to automotive systems.
- SOT, SSOP, HSOP: Small Outline Transistor (SOT), Shrink Small Outline Package (SSOP), and Heat Sink Small Outline Package (HSOP) are tailored for specific thermal and size requirements, ensuring devices operate within optimal temperature ranges.
- TO, TSSOP, ESOP, TSOT: These packages are designed for precision and efficiency, supporting a wide range of power levels and functionality. The emphasis is on thermal efficiency and miniaturization, suitable for high-performance electronics.
Contact Information
Address: Qipai Building, Dongguan, China, 523330
Phone: 86 769 8988 6666
Website: https://www.chippacking.com
