| Electronic Equipment, Instruments & Components Industry | Information Technology Sector | Mr. Xinyang Bao CEO | SSE Exchange | CNE1000043V6 ISIN |
| CN Country | - Employees | 11 May 2026 Last Dividend | - Last Split | - IPO Date |
Nanya New Material Technology Co.,Ltd is a prominent company founded in 2000, headquartered in Shanghai, China. It specializes in the manufacture, design, development, and sales of composite materials. Nanya serves a diverse range of industries, including consumer electronics, computers, communications, data centers, automotive electronics, security, aerospace, industrial control, and other terminal fields. It is known for its innovation and contribution to the 5G communication field through its advanced materials.
A foundational material used in the manufacture of printed circuit boards (PCBs), vital for various electronic devices. Nanya’s copper clad laminate is known for its quality and reliability, catering to the needs of the electronics manufacturing industry.
Bonding sheets are crucial for creating multi-layer PCBs, offering strong adhesion and durability. These materials are used to ensure the integrity and performance of complex electronic assemblies.
These are designed for various applications in electronic devices, providing bonding solutions that meet high standards of strength and thermal stability. Nanya's adhesive sheets are tailored to meet the evolving demands of the electronics industry.
Reflecting the company's commitment to environmental sustainability, these materials are used in producing eco-friendly electronic products. They meet stringent global environmental standards without compromising performance.
These materials are essential for the next generation of communication technologies, including 5G. They are designed to perform under the extreme demands of high-speed data transmission and high-frequency operations, contributing significantly to advancements in communication technologies.
Integrated Circuit (IC) packaging base materials from Nanya provide the foundation for reliable IC packaging solutions. These materials are crucial for protecting and ensuring the functionality of semiconductor chips, which are integral components of modern electronic devices.