| Machinery Industry | Industrials Sector | Mr. Jianbo Liu CEO | SSE Exchange | CNE1000051C9 ISIN |
| CN Country | 1,312 Employees | 16 Jul 2026 Last Dividend | 13 Jun 2024 Last Split | - IPO Date |
Kunshan Dongwei Technology Co.,Ltd., established in 2005 and based in Kunshan, China, is a prominent entity in the field of print circuit board (PCB) plating equipment industry. The company is dedicated to the research and development, manufacturing, and sale of sophisticated equipment used in the plating of print circuit boards across China. Its commitment to innovation and quality has positioned it as a key player in the provision of plating solutions, catering to a diverse range of industries. In addition to its mainstay products, Kunshan Dongwei Technology extends its expertise to offering highly specialized technical services, including engineering consulting, application training, and comprehensive technical support to its clientele.